DPS256X16BA3-25C datasheet, PDF

DPS256X16BA3-25C: DescriptionSRAM Module, 512KX8, 25ns, CMOS, CPGA50, CERAMIC, MODULE, SLCC, PGA-50; Categorystorage storage; File Size802KB，10 Pages; ManufacturerB&B Electronics Manufacturing Company

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DPS256X16BA3-25C Overview

SRAM Module, 512KX8, 25ns, CMOS, CPGA50, CERAMIC, MODULE, SLCC, PGA-50

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	B&B Electronics Manufacturing Company
Parts packaging code	PGA
package instruction	APGA, PGA50,5X10
Contacts	50
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	25 ns
Other features	USER CONFIGURABLE AS 256K X 16
I/O type	COMMON
JESD-30 code	R-CPGA-P50
JESD-609 code	e0
length	25.146 mm
memory density	4194304 bit
Memory IC Type	SRAM MODULE
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	50
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX8
Output characteristics	3-STATE
Exportable	YES
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	APGA
Encapsulate equivalent code	PGA50,5X10
Package shape	RECTANGULAR
Package form	GRID ARRAY, PIGGYBACK
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Maximum seat height	11.9888 mm
Maximum standby current	0.001 A
Minimum standby current	2 V
Maximum slew rate	0.34 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
width	13.716 mm

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