MEMORY MODULE,DRAM,FAST PAGE,1MX(8+1),CMOS,SIP,30PIN,PLASTIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Renesas Electronics Corporation |
Parts packaging code | SIMM |
package instruction | , SIP30,.2 |
Contacts | 30 |
Reach Compliance Code | unknown |
Maximum access time | 100 ns |
I/O type | COMMON |
JESD-609 code | e0 |
memory density | 9437184 bit |
Memory IC Type | FAST PAGE DRAM MODULE |
memory width | 9 |
Number of terminals | 30 |
word count | 1048576 words |
character code | 1000000 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 1MX9 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
Encapsulate equivalent code | SIP30,.2 |
power supply | 5 V |
Certification status | Not Qualified |
refresh cycle | 512 |
Maximum seat height | 21.6154 mm |
Maximum standby current | 0.003 A |
Maximum slew rate | 0.54 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal pitch | 2.54 mm |
Terminal location | SINGLE |