Flash, 16MX16, 100ns, PBGA88, 8 X 11 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-88
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | SAMSUNG |
Parts packaging code | BGA |
package instruction | 8 X 11 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-88 |
Contacts | 88 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.1.A |
Maximum access time | 100 ns |
Other features | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
startup block | BOTTOM |
command user interface | YES |
Universal Flash Interface | YES |
Data polling | YES |
JESD-30 code | R-PBGA-B88 |
JESD-609 code | e1 |
length | 11 mm |
memory density | 268435456 bit |
Memory IC Type | FLASH |
memory width | 16 |
Humidity sensitivity level | 2 |
Number of functions | 1 |
Number of departments/size | 4,255 |
Number of terminals | 88 |
word count | 16777216 words |
character code | 16000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -25 °C |
organize | 16MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TFBGA |
Encapsulate equivalent code | BGA88,8X12,32 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 1.8 V |
Programming voltage | 1.8 V |
Certification status | Not Qualified |
ready/busy | YES |
Maximum seat height | 1.2 mm |
Department size | 16K,64K |
Maximum standby current | 0.00002 A |
Maximum slew rate | 0.055 mA |
Maximum supply voltage (Vsup) | 1.95 V |
Minimum supply voltage (Vsup) | 1.7 V |
Nominal supply voltage (Vsup) | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | OTHER |
Terminal surface | TIN SILVER COPPER |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 40 |
switch bit | YES |
type | NOR TYPE |
width | 8 mm |