FPGA, 100 CLBS, 1500 GATES, 113 MHz, PQFP64
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | XILINX |
Parts packaging code | PGA |
package instruction | HPGA, PGA175,16X16 |
Contacts | 175 |
Reach Compliance Code | unknown |
Other features | MAX USABLE 7500 LOGIC GATES |
maximum clock frequency | 323 MHz |
Combined latency of CLB-Max | 1.75 ns |
JESD-30 code | S-PPGA-P175 |
length | 42.164 mm |
Humidity sensitivity level | 1 |
Configurable number of logic blocks | 484 |
Equivalent number of gates | 6500 |
Number of entries | 144 |
Number of logical units | 484 |
Output times | 144 |
Number of terminals | 175 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | |
organize | 484 CLBS, 6500 GATES |
Package body material | PLASTIC/EPOXY |
encapsulated code | HPGA |
Encapsulate equivalent code | PGA175,16X16 |
Package shape | SQUARE |
Package form | GRID ARRAY, HEAT SINK/SLUG |
Peak Reflow Temperature (Celsius) | 225 |
power supply | 5 V |
Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY |
Certification status | Not Qualified |
Maximum seat height | 4.191 mm |
Maximum supply voltage | 5.25 V |
Minimum supply voltage | 4.75 V |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | OTHER |
Terminal form | PIN/PEG |
Terminal pitch | 2.54 mm |
Terminal location | PERPENDICULAR |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 42.164 mm |