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Datasheet> All Categories > storage> storage> MCM64ZA18ZP8R
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MCM64ZA18ZP8R

Description
1MX18 ZBT SRAM, 8ns, PBGA119, PLASTIC, BGA-119
Categorystorage    storage   
File Size231KB，34 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

MCM64ZA18ZP8R Overview

1MX18 ZBT SRAM, 8ns, PBGA119, PLASTIC, BGA-119

MCM64ZA18ZP8R Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMotorola ( NXP )
Parts packaging codeBGA
package instructionBGA, BGA119,7X17,50
Contacts119
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time8 ns
Other featuresALSO REQUIRES 2.5V I/O SUPPLY
I/O typeCOMMON
JESD-30 codeR-PBGA-B119
JESD-609 codee0
length22 mm
memory density18874368 bit
Memory IC TypeZBT SRAM
memory width18
Number of functions1
Number of terminals119
word count1048576 words
character code1000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX18
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA119,7X17,50
Package shapeRECTANGULAR
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply2.5 V
Certification statusNot Qualified
Maximum seat height2.4 mm
Maximum standby current0.01 A
Minimum standby current2.4 V
Maximum slew rate0.29 mA
Maximum supply voltage (Vsup)2.625 V
Minimum supply voltage (Vsup)2.375 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width14 mm

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Description 1MX18 ZBT SRAM, 8ns, PBGA119, PLASTIC, BGA-119 512KX36 ZBT SRAM, 8.5ns, PBGA119, PLASTIC, BGA-119 512KX36 ZBT SRAM, 8.5ns, PBGA119, PLASTIC, BGA-119 512KX36 ZBT SRAM, 8ns, PBGA119, PLASTIC, BGA-119 1MX18 ZBT SRAM, 8.5ns, PBGA119, PLASTIC, BGA-119 512KX36 ZBT SRAM, 7ns, PQFP100, TQFP-100 1MX18 ZBT SRAM, 8ns, PQFP100, TQFP-100 1MX18 ZBT SRAM, 7ns, PQFP100, TQFP-100 1MX18 ZBT SRAM, 8ns, PQFP100, TQFP-100
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP )
Parts packaging code BGA BGA BGA BGA BGA QFP QFP QFP QFP
package instruction BGA, BGA119,7X17,50 BGA, BGA119,7X17,50 BGA, BGA119,7X17,50 BGA, BGA119,7X17,50 BGA, BGA119,7X17,50 LQFP, QFP100,.63X.87 LQFP, QFP100,.63X.87 LQFP, QFP100,.63X.87 LQFP, QFP100,.63X.87
Contacts 119 119 119 119 119 100 100 100 100
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknow unknow
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time 8 ns 8.5 ns 8.5 ns 8 ns 8.5 ns 7 ns 8 ns 7 ns 8 ns
Other features ALSO REQUIRES 2.5V I/O SUPPLY ALSO REQUIRES 2.5V I/O SUPPLY ALSO REQUIRES 2.5V I/O SUPPLY ALSO REQUIRES 2.5V I/O SUPPLY ALSO REQUIRES 2.5V I/O SUPPLY ALSO REQUIRES 2.5V I/O SUPPLY ALSO REQUIRES 2.5V I/O SUPPLY ALSO REQUIRES 2.5V I/O SUPPLY ALSO REQUIRES 2.5V I/O SUPPLY
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PBGA-B119 R-PBGA-B119 R-PBGA-B119 R-PBGA-B119 R-PBGA-B119 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0
length 22 mm 22 mm 22 mm 22 mm 22 mm 20 mm 20 mm 20 mm 20 mm
memory density 18874368 bit 18874368 bit 18874368 bit 18874368 bit 18874368 bit 18874368 bit 18874368 bit 18874368 bi 18874368 bi
Memory IC Type ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM
memory width 18 36 36 36 18 36 18 18 18
Number of functions 1 1 1 1 1 1 1 1 1
Number of terminals 119 119 119 119 119 100 100 100 100
word count 1048576 words 524288 words 524288 words 524288 words 1048576 words 524288 words 1048576 words 1048576 words 1048576 words
character code 1000000 512000 512000 512000 1000000 512000 1000000 1000000 1000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 1MX18 512KX36 512KX36 512KX36 1MX18 512KX36 1MX18 1MX18 1MX18
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA BGA LQFP LQFP LQFP LQFP
Encapsulate equivalent code BGA119,7X17,50 BGA119,7X17,50 BGA119,7X17,50 BGA119,7X17,50 BGA119,7X17,50 QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.4 mm 2.4 mm 2.4 mm 2.4 mm 2.4 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm
Maximum standby current 0.01 A 0.01 A 0.01 A 0.01 A 0.01 A 0.01 A 0.01 A 0.01 A 0.01 A
Minimum standby current 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V
Maximum slew rate 0.29 mA 0.28 mA 0.28 mA 0.29 mA 0.28 mA 0.3 mA 0.29 mA 0.3 mA 0.29 mA
Maximum supply voltage (Vsup) 2.625 V 2.625 V 2.625 V 2.625 V 2.625 V 2.625 V 2.625 V 2.625 V 2.625 V
Minimum supply voltage (Vsup) 2.375 V 2.375 V 2.375 V 2.375 V 2.375 V 2.375 V 2.375 V 2.375 V 2.375 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL BALL BALL BALL BALL GULL WING GULL WING GULL WING GULL WING
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm

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