IC 4M X 72 SYNCHRONOUS DRAM MODULE, 7 ns, DMA144, DIMM, SO-144, Dynamic RAM
Parameter Name | Attribute value |
Maker | Toshiba Semiconductor |
Parts packaging code | MODULE |
package instruction | DIMM, DIMM144,32 |
Contacts | 144 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
access mode | FOUR BANK PAGE BURST |
Maximum access time | 7 ns |
Maximum clock frequency (fCLK) | 100 MHz |
I/O type | COMMON |
JESD-30 code | R-XDMA-N144 |
memory density | 301989888 bit |
Memory IC Type | SYNCHRONOUS DRAM MODULE |
memory width | 72 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 144 |
word count | 4194304 words |
character code | 4000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 4MX72 |
Output characteristics | 3-STATE |
Package body material | UNSPECIFIED |
encapsulated code | DIMM |
Encapsulate equivalent code | DIMM144,32 |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
power supply | 3.3 V |
Certification status | Not Qualified |
refresh cycle | 4096 |
Maximum standby current | 0.005 A |
Maximum slew rate | 0.55 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | NO LEAD |
Terminal pitch | 0.8 mm |
Terminal location | DUAL |
THLY724031BFG-10L | THLY724031BFG-80L | THLY724031BFG-80 | THLY724031BFG-10 | |
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Description | IC 4M X 72 SYNCHRONOUS DRAM MODULE, 7 ns, DMA144, DIMM, SO-144, Dynamic RAM | IC 4M X 72 SYNCHRONOUS DRAM MODULE, 6 ns, DMA144, DIMM, SO-144, Dynamic RAM | IC 4M X 72 SYNCHRONOUS DRAM MODULE, 6 ns, DMA144, DIMM, SO-144, Dynamic RAM | IC 4M X 72 SYNCHRONOUS DRAM MODULE, 7 ns, DMA144, DIMM, SO-144, Dynamic RAM |
Maker | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor |
Parts packaging code | MODULE | MODULE | MODULE | MODULE |
package instruction | DIMM, DIMM144,32 | DIMM, DIMM144,32 | DIMM, DIMM144,32 | DIMM, DIMM144,32 |
Contacts | 144 | 144 | 144 | 144 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
access mode | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
Maximum access time | 7 ns | 6 ns | 6 ns | 7 ns |
Maximum clock frequency (fCLK) | 100 MHz | 125 MHz | 125 MHz | 100 MHz |
I/O type | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 |
memory density | 301989888 bit | 301989888 bit | 301989888 bit | 301989888 bit |
Memory IC Type | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE |
memory width | 72 | 72 | 72 | 72 |
Number of functions | 1 | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 | 1 |
Number of terminals | 144 | 144 | 144 | 144 |
word count | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
character code | 4000000 | 4000000 | 4000000 | 4000000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 4MX72 | 4MX72 | 4MX72 | 4MX72 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
encapsulated code | DIMM | DIMM | DIMM | DIMM |
Encapsulate equivalent code | DIMM144,32 | DIMM144,32 | DIMM144,32 | DIMM144,32 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
refresh cycle | 4096 | 4096 | 4096 | 4096 |
Maximum standby current | 0.005 A | 0.005 A | 0.005 A | 0.005 A |
Maximum slew rate | 0.55 mA | 0.7 mA | 0.7 mA | 0.55 mA |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
Terminal pitch | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |