S29GL032N90FFI33 datasheet, PDF

S29GL032N90FFI33: DescriptionFlash, 2MX16, 90ns, PBGA64, 13 X 11 MM, LEAD FREE, FBGA-64; Categorystorage storage; File Size3MB，81 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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S29GL032N90FFI33 Overview

Flash, 2MX16, 90ns, PBGA64, 13 X 11 MM, LEAD FREE, FBGA-64

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	SPANSION
Parts packaging code	BGA
package instruction	13 X 11 MM, LEAD FREE, FBGA-64
Contacts	64
Reach Compliance Code	compliant
ECCN code	3A991.B.1.A
Maximum access time	90 ns
Spare memory width	8
JESD-30 code	R-PBGA-B64
JESD-609 code	e1
length	13 mm
memory density	33554432 bit
Memory IC Type	FLASH
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of terminals	64
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2MX16
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
Programming voltage	3 V
Certification status	Not Qualified
Maximum seat height	1.4 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	11 mm

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