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PALC18U8Q25CJ

Description
Programmable Logic Device, PAL-Type, CMOS, CDIP20,
CategoryProgrammable logic devices    Programmable logic   
File Size1MB,19 Pages
ManufacturerMonolithic Memories
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PALC18U8Q25CJ Overview

Programmable Logic Device, PAL-Type, CMOS, CDIP20,

PALC18U8Q25CJ Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMonolithic Memories
Reach Compliance Codeunknown
ArchitecturePAL-TYPE
maximum clock frequency28.5 MHz
JESD-30 codeR-XDIP-T20
JESD-609 codee0
Number of entries18
Output times8
Number of product terms74
Number of terminals20
Maximum operating temperature70 °C
Minimum operating temperature
Output functionMACROCELL
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP20,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Certification statusNot Qualified
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

PALC18U8Q25CJ Related Products

PALC18U8Q25CJ PALC18U8Q35CN PALC18U8Q35CNL PALC18U8Q35CQ PALC18U8Q25CNL PALC18U8Q25CN PALC18U8Q25CQ PALC18U8Q35CJ
Description Programmable Logic Device, PAL-Type, CMOS, CDIP20, Programmable Logic Device, PAL-Type, CMOS, PDIP20, Programmable Logic Device, PAL-Type, CMOS, PQCC20, Programmable Logic Device, PAL-Type, CMOS, CDIP20, Programmable Logic Device, PAL-Type, CMOS, PQCC20, Programmable Logic Device, PAL-Type, CMOS, PDIP20, Programmable Logic Device, PAL-Type, CMOS, CDIP20, Programmable Logic Device, PAL-Type, CMOS, CDIP20,
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
Architecture PAL-TYPE PAL-TYPE PAL-TYPE PAL-TYPE PAL-TYPE PAL-TYPE PAL-TYPE PAL-TYPE
maximum clock frequency 28.5 MHz 20 MHz 20 MHz 20 MHz 28.5 MHz 28.5 MHz 28.5 MHz 20 MHz
JESD-30 code R-XDIP-T20 R-PDIP-T20 S-PQCC-J20 R-XDIP-T20 S-PQCC-J20 R-PDIP-T20 R-XDIP-T20 R-XDIP-T20
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0
Number of entries 18 18 18 18 18 18 18 18
Output times 8 8 8 8 8 8 8 8
Number of product terms 74 74 74 74 74 74 74 74
Number of terminals 20 20 20 20 20 20 20 20
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
Output function MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL
Package body material CERAMIC PLASTIC PLASTIC CERAMIC PLASTIC PLASTIC CERAMIC CERAMIC
encapsulated code DIP DIP QCCJ DIP QCCJ DIP DIP DIP
Encapsulate equivalent code DIP20,.3 DIP20,.3 LDCC20,.4SQ DIP20,.3 LDCC20,.4SQ DIP20,.3 DIP20,.3 DIP20,.3
Package shape RECTANGULAR RECTANGULAR SQUARE RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE CHIP CARRIER IN-LINE CHIP CARRIER IN-LINE IN-LINE IN-LINE
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO YES NO YES NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE J BEND THROUGH-HOLE J BEND THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL QUAD DUAL QUAD DUAL DUAL DUAL
Maker Monolithic Memories - - - Monolithic Memories Monolithic Memories Monolithic Memories Monolithic Memories

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