Telecom Circuit, 1-Func, CMOS, PQCC28, PLASTIC, LCC-28
Parameter Name | Attribute value |
Maker | SIEMENS |
Parts packaging code | QLCC |
package instruction | , |
Contacts | 28 |
Reach Compliance Code | unknown |
JESD-30 code | R-PQCC-J28 |
Number of functions | 1 |
Number of terminals | 28 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
Package shape | RECTANGULAR |
Package form | CHIP CARRIER |
Certification status | Not Qualified |
Nominal supply voltage | 5 V |
surface mount | YES |
technology | CMOS |
Telecom integrated circuit types | TELECOM CIRCUIT |
Temperature level | INDUSTRIAL |
Terminal form | J BEND |
Terminal location | QUAD |
H67100-H6246 | PEB2070PV2.4 | PEB2070NV2.4 | |
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Description | Telecom Circuit, 1-Func, CMOS, PQCC28, PLASTIC, LCC-28 | Telecom Circuit, 1-Func, CMOS, PDIP24, PLASTIC, DIP-24 | Telecom Circuit, 1-Func, CMOS, PQCC28, PLASTIC, LCC-28 |
Parts packaging code | QLCC | DIP | QLCC |
Contacts | 28 | 24 | 28 |
Reach Compliance Code | unknown | unknown | unknown |
JESD-30 code | R-PQCC-J28 | R-PDIP-T24 | R-PQCC-J28 |
Number of functions | 1 | 1 | 1 |
Number of terminals | 28 | 24 | 28 |
Maximum operating temperature | 85 °C | 70 °C | 70 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | CHIP CARRIER | IN-LINE | CHIP CARRIER |
Certification status | Not Qualified | Not Qualified | Not Qualified |
Nominal supply voltage | 5 V | 5 V | 5 V |
surface mount | YES | NO | YES |
technology | CMOS | CMOS | CMOS |
Telecom integrated circuit types | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT |
Temperature level | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
Terminal form | J BEND | THROUGH-HOLE | J BEND |
Terminal location | QUAD | DUAL | QUAD |
Base Number Matches | - | 1 | 1 |