MXLSMCJ20CAE3TR datasheet, PDF

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MXLSMCJ20CAE3TR: Description1500W, BIDIRECTIONAL, SILICON, TVS DIODE, DO-214AB, ROHS COMPLIANT, PLASTIC, SMCJ, 2 PIN; CategoryDiscrete semiconductor diode; File Size345KB，4 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com; Environmental Compliance

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MXLSMCJ20CAE3TR Overview

1500W, BIDIRECTIONAL, SILICON, TVS DIODE, DO-214AB, ROHS COMPLIANT, PLASTIC, SMCJ, 2 PIN

MXLSMCJ20CAE3TR Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Microsemi
Parts packaging code	DO-214AB
package instruction	R-PDSO-J2
Contacts	2
Reach Compliance Code	unknown
ECCN code	EAR99
Other features	HIGH RELIABILITY
Maximum breakdown voltage	24.5 V
Minimum breakdown voltage	22.2 V
Breakdown voltage nominal value	23.35 V
Maximum clamping voltage	32.4 V
Configuration	SINGLE
Diode component materials	SILICON
Diode type	TRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95 code	DO-214AB
JESD-30 code	R-PDSO-J2
JESD-609 code	e3
Humidity sensitivity level	1
Maximum non-repetitive peak reverse power dissipation	1500 W
Number of components	1
Number of terminals	2
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	260
polarity	BIDIRECTIONAL
Maximum power dissipation	1.56 W
Certification status	Not Qualified
Guideline	MIL-19500
Maximum repetitive peak reverse voltage	20 V
surface mount	YES
technology	AVALANCHE
Terminal surface	Matte Tin (Sn) - annealed
Terminal form	J BEND
Terminal location	DUAL
Maximum time at peak reflow temperature	40

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TECHNICAL DATA SHEET

Gort Road Business Park, Ennis, Co. Clare, Ireland.

Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298

Website: http://www.microsemi.com

6 Lake Street, Lawrence, MA 01841

Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803

SURFACE MOUNT 1500 Watt

Transient Voltage Suppressor

- High Reliability controlled devices

- Unidirectional (A) and Bidirectional (CA) construction

- Available in both J-bend and Gull-wing terminations

- Selections for 5.0 to 170 V standoff voltages (V

)

LEVELS

M, MA, MX, MXL

DEVICES

MSMCJ5.0A thru MSMCJ170CA, e3

and MSMCG5.0A thru MSMCG170CA, e3

FEATURES



High reliability controlled devices with fabrication and assembly lot traceability

100 % surge tested devices

Optional upscreening available by replacing the M prefix with MA, MX or MXL prefixes.

These prefixes specify various screening and conformance inspection options based on

MIL-PRF-19500. Refer to

MicroNote 129

for more details on the screening options.

Axial-lead equivalent packages for thru-hole mounting available as 1.5KE6.8A to

1.5KE200CA or 1N6267 thru 1N6303A and 1N5908 (consult factory for other surface mount

options).

Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B

RoHS compliant devices available by adding an “e3” suffix

3σ lot norm screening performed on Standby Current I

APPLICATIONS / BENEFITS



Protection from switching transients and induced RF

Protection from ESD and EFT per IEC 61000-4-2 and IEC 61000-4-4

Secondary lightening protection per IEC 61000-4-5 with 42 Ohms source impedance:

Class 1: MSMC5.0A to MSMC170CA

Class 2: MSMC5.0A to MSMC150CA

Class 3: MSMC5.0A to MSMC75CA

Class 4: MSMC5.0A to MSMC36CA

Secondary lightening protection per IEC 61000-4-5 with 12 Ohms source impedance:

Class 1: MSMC5.0A to MSMC90CA

Class 2: MSMC5.0A to MSMC45CA

Class 3: MSMC5.0A to MSMC24CA

Class 4: MSMC5.0A to MSMC11CA

Secondary lightening protection per IEC 61000-4-5 with 2 Ohms source impedance:

Class 2: MSMC5.0A to MSMC22CA

Class 3: MSMC5.0A to MSMC10CA



MAXIMUM RATINGS



Peak Pulse Power dissipation at 25 ºC: 1500 watts at 10/1000 μs (also see Figures 1,2, and

3) with impulse repetition rate (duty factor) of 0.01 % or less

clamping

(0 volts to V

min.): < 100 ps theoretical for unidirectional and <5 ns for bidirectional

Operating and Storage temperature: -65 ºC to +150 ºC

Thermal resistance: 20 ºC/W junction to lead, or 80 ºC/W junction to ambient when mounted

on FR4 PC board (1oz Cu) with recommended footprint (see page 2)

Steady-State Power dissipation: 6 watts at TL = 30 ºC, or 1.56 watts at TA = 25 ºC when

mounted on FR4 PC board with recommended footprint (see page 2)

Forward Surge: 200 Amps peak impulse of 8.3 ms half-sine wave at 25 ºC (unidirectional

only)

Solder temperatures: 260 ºC for 10 s (maximum)

RF01001 Rev A, June 2010

High Reliability Product Group

Page 1 of 4

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