TECHNICAL DATA SHEET
Gort Road Business Park, Ennis, Co. Clare, Ireland.
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298
Website: http://www.microsemi.com
6 Lake Street, Lawrence, MA 01841
Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803
SURFACE MOUNT 1500 Watt
Transient Voltage Suppressor
- High Reliability controlled devices
- Unidirectional (A) and Bidirectional (CA) construction
- Available in both J-bend and Gull-wing terminations
- Selections for 5.0 to 170 V standoff voltages (V
WM
)
LEVELS
M, MA, MX, MXL
DEVICES
MSMCJ5.0A thru MSMCJ170CA, e3
and MSMCG5.0A thru MSMCG170CA, e3
FEATURES
High reliability controlled devices with fabrication and assembly lot traceability
100 % surge tested devices
Optional upscreening available by replacing the M prefix with MA, MX or MXL prefixes.
These prefixes specify various screening and conformance inspection options based on
MIL-PRF-19500. Refer to
MicroNote 129
for more details on the screening options.
Axial-lead equivalent packages for thru-hole mounting available as 1.5KE6.8A to
1.5KE200CA or 1N6267 thru 1N6303A and 1N5908 (consult factory for other surface mount
options).
Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B
RoHS compliant devices available by adding an “e3” suffix
3σ lot norm screening performed on Standby Current I
D
Refer to table below
for dimensions
APPLICATIONS / BENEFITS
Protection from switching transients and induced RF
Protection from ESD and EFT per IEC 61000-4-2 and IEC 61000-4-4
Secondary lightening protection per IEC 61000-4-5 with 42 Ohms source impedance:
o
Class 1: MSMC5.0A to MSMC170CA
o
Class 2: MSMC5.0A to MSMC150CA
o
Class 3: MSMC5.0A to MSMC75CA
o
Class 4: MSMC5.0A to MSMC36CA
Secondary lightening protection per IEC 61000-4-5 with 12 Ohms source impedance:
o
Class 1: MSMC5.0A to MSMC90CA
o
Class 2: MSMC5.0A to MSMC45CA
o
Class 3: MSMC5.0A to MSMC24CA
o
Class 4: MSMC5.0A to MSMC11CA
Secondary lightening protection per IEC 61000-4-5 with 2 Ohms source impedance:
o
Class 2: MSMC5.0A to MSMC22CA
o
Class 3: MSMC5.0A to MSMC10CA
MAXIMUM RATINGS
Peak Pulse Power dissipation at 25 ºC: 1500 watts at 10/1000
μs
(also see Figures 1,2, and
3) with impulse repetition rate (duty factor) of 0.01 % or less
t
clamping
(0 volts to V
BR
min.): < 100 ps theoretical for unidirectional and <5 ns for bidirectional
Operating and Storage temperature: -65 ºC to +150 ºC
Thermal resistance: 20 ºC/W junction to lead, or 80 ºC/W junction to ambient when mounted
on FR4 PC board (1oz Cu) with recommended footprint (see page 2)
Steady-State Power dissipation: 6 watts at TL = 30 ºC, or 1.56 watts at TA = 25 ºC when
mounted on FR4 PC board with recommended footprint (see page 2)
Forward Surge: 200 Amps peak impulse of 8.3 ms half-sine wave at 25 ºC (unidirectional
only)
Solder temperatures: 260 ºC for 10 s (maximum)
RF01001 Rev B, Sept 2011
High Reliability Product Group
Page 1 of 4
TECHNICAL DATA SHEET
Gort Road Business Park, Ennis, Co. Clare, Ireland.
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298
6 Lake Street, Lawrence, MA 01841
Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803
Website: http://www.microsemi.com
___________________________________________________________________________________________________________________________________
MECHANICAL AND PACKAGING
Void-free transfer molded thermosetting epoxy body meeting UL94V-0
Gull-wing or J-bend tin-lead (90 % Sn, 10 % Pb) or RoHS (100 % Sn) compliant annealed matte-tin plating
solderable per MIL-STD-750, method 2026
Cathode indicated by band. No cathode band on bi-directional devices.
Part number marked on package
Available in bulk or custom tape-and-reel packaging
TAPE-AND-REEL option available with up to 750 devices on 7 inch reel or up to 2500 devices on 13 inch reel per
EIA-481-1-A with 12 mm tape. Add “TR” suffix to part number.
Weight: 0.25 grams (approximately)
PACKAGE DIMENSIONS
SMCJ
SMCG
A
.115
.121
2.92
3.07
DIMENSIONS IN INCHES
B
C
D
E
F
.260 .220 .305 .077 .380
.280 .245 .320 .110 .400
DIMENSIONS IN MILLIMETERS
6.60 5.59 7.75 1.95 9.65
7.11 6.22 8.13 2.80 10.16
K
.025
.040
0.635
1.016
L
.030
.060
.760
1.520
MIN
MAX
MIN
MAX
(DO-214AB)
(DO-215AB)
Typical Standoff Height: 0.004” – 0.008” (0.1mm – 0.2mm)
PAD LAYOUT
SMCJ (DO-214AB)
A
B
C
INCHES
0.390
0.110
0.150
mm
9.90
2.79
3.81
SMCG (DO-215AB)
A
B
C
INCHES
0.510
0.110
0.150
mm
12.95
2.79
3.81
SYMBOLS & DEFINITIONS
Symbol
V
WM
P
PP
V
BR
I
D
Definition
Working Peak (Standoff) Voltage
Peak Pulse Power
Breakdown Voltage
Standby Current
Symbol
I
PP
V
C
Definition
Peak Pulse Current
Clamping Voltage
Breakdown Current for V
BR
I
BR
RF01001 Rev B, Sept 2011
High Reliability Product Group
Page 2 of 4
TECHNICAL DATA SHEET
Gort Road Business Park, Ennis, Co. Clare, Ireland.
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298
6 Lake Street, Lawrence, MA 01841
Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803
Website: http://www.microsemi.com
___________________________________________________________________________________________________________________________________
ELECTRICAL CHARACTERISTICS @ 25
o
C
REVERSE
STAND-OFF
VOLTAGE
V
WM
BREAKDOWN
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
V
C
@ I
PP
PEAK PULSE
CURRENT
(see Fig. 2)
I
PP
MAXIMUM
STANDBY
CURRENT
I
D
@ V
WM
MICROSEMI PART NUMBER
V
BR
@ I
BR
V
6.40 – 7.00
6.67 – 7.37
7.22 – 7.98
7.78 – 8.60
8.33 – 9.21
8.89 – 9.83
9.44 – 10.4
10.0 – 11.1
11.1 – 12.3
12.2 – 13.5
13.3 – 14.7
14.4 – 15.9
15.6 – 17.2
16.7 – 18.5
17.8 – 19.7
18.9 – 20.9
20.0 – 22.1
22.2 – 24.5
24.4 – 26.9
26.7 – 29.5
28.9 – 31.9
31.1 – 34.4
33.3 – 36.8
36.7 – 40.6
40.0 – 44.2
44.4 – 49.1
47.8 – 52.8
50.0 – 55.3
53.3 – 58.9
56.7 – 62.7
60.0 – 66.3
64.4 – 71.2
66.7 – 73.7
71.1 – 78.6
77.8 – 86.0
83.3 – 92.1
86.7 – 95.8
94.4 – 104.0
100 – 111
111 – 123
122 – 135
133 – 147
144 – 159
167 – 185
178 – 197
189 – 209
mA
10
10
10
10
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
GULL-WING
MSMCG5.0A
MSMCG6.0A
MSMCG6.5A
MSMCG7.0A
MSMCG7.5A
MSMCG8.0A
MSMCG8.5A
MSMCG9.0A
MSMCG10A
MSMCG11A
MSMCG12A
MSMCG13A
MSMCG14A
MSMCG15A
MSMCG16A
MSMCG17A
MSMCG18A
MSMCG20A
MSMCG22A
MSMCG24A
MSMCG26A
MSMCG28A
MSMCG30A
MSMCG33A
MSMCG36A
MSMCG40A
MSMCG43A
MSMCG45A
MSMCG48A
MSMCG51A
MSMCG54A
MSMCG58A
MSMCG60A
MSMCG64A
MSMCG70A
MSMCG75A
MSMCG78A
MSMCG85A
MSMCG90A
MSMCG100A
MSMCG110A
MSMCG120A
MSMCG130A
MSMCG150A
MSMCG160A
MSMCG170A
J- BEND
MSMCJ5.0A
MSMCJ6.0A
MSMCJ6.5A
MSMCJ7.0A
MSMCJ7.5A
MSMCJ8.0A
MSMCJ8.5A
MSMCJ9.0A
MSMCJ10A
MSMCJ11A
MSMCJ12A
MSMCJ13A
MSMCJ14A
MSMCJ15A
MSMCJ16A
MSMCJ17A
MSMCJ18A
MSMCJ20A
MSMCJ22A
MSMCJ24A
MSMCJ26A
MSMCJ28A
MSMCJ30A
MSMCJ33A
MSMCJ36A
MSMCJ40A
MSMCJ43A
MSMCJ45A
MSMCJ48A
MSMCJ51A
MSMCJ54A
MSMCJ58A
MSMCJ60A
MSMCJ64A
MSMCJ70A
MSMCJ75A
MSMCJ78A
MSMCJ85A
MSMCJ90A
MSMCJ100A
MSMCJ110A
MSMCJ120A
MSMCJ130A
MSMCJ150A
MSMCJ160A
MSMCJ170A
V
5.0
6.0
6.5
7.0
7.5
8.0
8.5
9.0
10
11
12
13
14
15
16
17
18
20
22
24
26
28
30
33
36
40
43
45
48
51
54
58
60
64
70
75
78
85
90
100
110
120
130
150
160
170
V
9.2
10.3
11.2
12.0
12.9
13.6
14.4
15.4
17.0
18.2
19.9
21.5
23.2
24.4
26.0
27.6
29.2
32.4
35.5
38.9
42.1
45.4
48.4
53.3
58.1
64.5
69.4
72.7
77.4
82.4
87.1
93.6
96.8
103.0
113
121
126
137
146
162
177
193
209
243
259
275
A
163.0
145.6
133.9
125.0
116.3
110.3
104.2
97.4
88.2
82.4
75.3
69.7
64.7
61.5
57.7
53.3
51.4
46.3
42.2
38.6
35.6
33.0
31.0
28.1
25.8
23.2
21.6
20.6
19.4
18.2
17.2
16.0
15.5
14.6
13.3
12.4
11.4
10.4
10.3
9.3
8.4
7.8
7.2
6.2
5.8
5.5
μA
1000
1000
500
200
100
50
20
10
5
5
5
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
NOTE 1:
For Bidirectional device types indicate CA suffix after the part number. (i.e. MSMCJ170CA). Bidirectional
capacitance is half that shown in Figure 4 at zero volts.
NOTE 2:
Microsemi Corp’s MSMC series (1500 W) surface mountable packages are designed specifically for transient voltage
suppression. The wide leads assure a large surface contact for good heat dissipation, and a low resistance path for
surge current flow to ground. These high speed transient voltage suppressors can be used to effectively protect
sensitive components such as integrated circuits and MOS device.
RF01001 Rev B, Sept 2011
High Reliability Product Group
Page 3 of 4
TECHNICAL DATA SHEET
Gort Road Business Park, Ennis, Co. Clare, Ireland.
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298
6 Lake Street, Lawrence, MA 01841
Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803
Website: http://www.microsemi.com
___________________________________________________________________________________________________________________________________
GRAPHS
100
(Waveform – See Figure 2)
Non-repetitive
10
(P
PP
) – Peak Pulse Power - kW
1.0
0
1µs
10µs
100µs
1ms
10 ms
tp – Pulse Time – sec
Test waveform parameters
tr = 10µs, tp = 1000µs
FIGURE 2
–
Pulse Waveform
FIGURE 1 –
Peak Pulse Power vs. Pulse Time
Peak Pulse Power (
P
PP
) or continuous
o
Power in Percent of 25 C Rating
T
L
Lead Temperature C
o
Capacitance in pF
Breakdown Voltage in Volts
FIGURE 3
–
Derating Curve
FIGURE 4
–
Typical Capacitance vs. Breakdown
RF01001 Rev B, Sept 2011
High Reliability Product Group
Page 4 of 4
PCB Design
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