IC,DECODER/DEMUX,2-TO-4-LINE,ECL10,DIP,16PIN,CERAMIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | NXP |
package instruction | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
JESD-30 code | R-XDIP-T16 |
JESD-609 code | e0 |
Logic integrated circuit type | OTHER DECODER/DRIVER |
Number of functions | 2 |
Number of terminals | 16 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -30 °C |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | -5.2 V |
Maximum supply current (ICC) | 85 mA |
Prop。Delay @ Nom-Sup | 6.4 ns |
Certification status | Not Qualified |
surface mount | NO |
technology | ECL10K |
Temperature level | OTHER |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
MC10171L | MC10171PS | MC10171FN | |
---|---|---|---|
Description | IC,DECODER/DEMUX,2-TO-4-LINE,ECL10,DIP,16PIN,CERAMIC | IC,DECODER/DEMUX,2-TO-4-LINE,ECL10,DIP,16PIN,PLASTIC | IC,DECODER/DEMUX,2-TO-4-LINE,ECL10,LDCC,20PIN,PLASTIC |
Is it Rohs certified? | incompatible | incompatible | incompatible |
Maker | NXP | NXP | NXP |
package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | QCCJ, LDCC20,.4SQ |
Reach Compliance Code | unknown | unknown | unknown |
JESD-30 code | R-XDIP-T16 | R-PDIP-T16 | S-PQCC-J20 |
JESD-609 code | e0 | e0 | e0 |
Logic integrated circuit type | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER |
Number of functions | 2 | 2 | 2 |
Number of terminals | 16 | 16 | 20 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -30 °C | -30 °C | -30 °C |
Package body material | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | QCCJ |
Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | LDCC20,.4SQ |
Package shape | RECTANGULAR | RECTANGULAR | SQUARE |
Package form | IN-LINE | IN-LINE | CHIP CARRIER |
power supply | -5.2 V | -5.2 V | -5.2 V |
Certification status | Not Qualified | Not Qualified | Not Qualified |
surface mount | NO | NO | YES |
technology | ECL10K | ECL10K | ECL10K |
Temperature level | OTHER | OTHER | OTHER |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | J BEND |
Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm |
Terminal location | DUAL | DUAL | QUAD |
Maximum supply current (ICC) | 85 mA | - | 85 mA |
Prop。Delay @ Nom-Sup | 6.4 ns | - | 6.4 ns |