S29GL032N70BAI30 datasheet, PDF

S29GL032N70BAI30: DescriptionFlash, 2MX16, 70ns, PBGA48, 8.15 X 6.15 MM, FBGA-48; Categorystorage storage; File Size3MB，79 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/

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S29GL032N70BAI30 Overview

Flash, 2MX16, 70ns, PBGA48, 8.15 X 6.15 MM, FBGA-48

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SPANSION
Parts packaging code	BGA
package instruction	VFBGA,
Contacts	48
Reach Compliance Code	compliant
ECCN code	3A991.B.1.A
Maximum access time	70 ns
Spare memory width	8
JESD-30 code	R-PBGA-B48
JESD-609 code	e0
length	8.15 mm
memory density	33554432 bit
Memory IC Type	FLASH
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of terminals	48
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2MX16
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	240
Programming voltage	3 V
Certification status	Not Qualified
Maximum seat height	1 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
type	NOR TYPE
width	6.15 mm

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