ELJPF8N2JFB datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Passive components> inductor> ELJPF8N2JFB

ELJPF8N2JFB: Description1 ELEMENT, 0.0082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD; CategoryPassive components inductor; File Size223KB，7 Pages; ManufacturerPanasonic; Websitehttp://www.panasonic.co.jp/semicon/e-index.html; Environmental Compliance

Download Datasheet Parametric View All

ELJPF8N2JFB Overview

1 ELEMENT, 0.0082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD

ELJPF8N2JFB Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
package instruction	0402
Reach Compliance Code	unknow
ECCN code	EAR99
uppercase and lowercase codes	0402
structure	Chi
core material	CERAMIC
DC Resistance	0.21 Ω
Nominal inductance(L)	0.0082 µH
Inductor Applications	RF INDUCTOR
Inductor type	GENERAL PURPOSE INDUCTOR
JESD-609 code	e3
Number of functions	1
Number of terminals	2
Maximum operating temperature	85 °C
Minimum operating temperature	-20 °C
Package height	0.5 mm
Package length	1 mm
Package form	SMT
Package width	0.5 mm
method of packing	TR
Minimum quality factor (at nominal inductance)	7
Maximum rated current	0.9 A
self resonant frequency	3700 MHz
Shape/Size Description	RECTANGULAR PACKAGE
shield	NO
surface mount	YES
Terminal surface	Tin (Sn)
Terminal location	DUAL ENDED
Terminal shape	WRAPAROUND
Test frequency	100 MHz
Tolerance	5%
Base Number Matches	1

Preview

Download Datasheet

View All

Fixed Inductors (Chip Inductors)

4. High Power Type PF, PE, PC, PA, PB

■

Features

●

Low DCR and large current capability, suitable for power circuitry.

●

Wire wound, resin molded chip inductor. (PC, PA, PB types)

●

Unique Ceramic Core/Laser-cut technology (PF, PE type)

●

Capable of being Re-ﬂow or ﬂow soldered.

●

Wide line-up from 1005 to 4532 case sizes.

●

Good for mounting.

■

Recommended Applications

●

AV equipment, Wireless communication equipment and various types of general electronic equipment.

■

Explanation of Part Numbers

Packaging Design No.

Product code

Chip Inductors

Shape

1005 (0402)

1608 (0603)

2520 (1008)

3225 (1210)

4532 (1812)

Inductance

1N5

10N

R22

3R3

470

561

1.5 nH

10 nH

220 nH

3.3

µH

560

µH

Inductance tolerance

±0.3

±5

±10

±20

Taping

Size : mm (inch)

■Storage

Conditions

: Normal temperature (–5 to 35 °C), normal humidity (85 %RH max.), shall not be exposed to

direct sunlight and harmful gases and care should be taken so as not to cause dew.

●

Operating Temperature : –20 to +85 °C

●

Package

■Storage

Period

●

Solderability may be reduced due to the conditions of high temperature and high humidity which causes the oxidation

of tin-plated terminals. Even if storage conditions are within speciﬁed limits, solderability may be reduced with the

passage of time. Therefore, please control the storage conditions and try to use the product within 6 months of receipt.

■Packaging

■Soldering

Conditions

■Safety

Precautions

Refer 27 and 28 page.

Refer 29 page.

Refer 30 page.

Jul. 2008

Design and speciﬁcations are each subject to change without notice. Ask factory for the current technical speciﬁcations before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Recommended Resources

Switch signal generation circuit

Touch type anti-theft alarm circuit 2

Lighting delay circuit using transistors Part 2

STKxx series application circuitb

Low temperature plasma ozone generator circuit

M830B/DT83B type 3 1/2 digit digital multimeter circuit

Supercapacitor integration optimizes hybrid bus powertrain: Problems such as the depletion of natural resources, air pollution, traffic congestion, and rising fossil fuel prices have forced societies and individuals to seek alternative means of transportation....; frozenviolet Discrete Device

[NXP Rapid IoT Review] Rapid IoT Studio Simple Programming Step 2 Counter plus Bluetooth: [NXP Rapid IoT Review] Rapid IoT Studio Simple Programming Step 2 Counter plus Bluetooth [size=3]1. Open [/size][size=14px] Rapid IoT Studio IDE [/size] [font=Microsoft Yahei, Hei, Tahoma, SimHei, san...; damiaa RF/Wirelessly

Four aspects to explain the difference between MPK (safety capacitor) and CBB capacitor: [size=4] In circuits with higher requirements, CBB capacitors replace common polystyrene or mica capacitors. This is mainly because CBB capacitors have an advantage in volume compared to polystyrene c...; fish001 Analogue and Mixed Signal

Share some questions about using BQ76930 and BQ78350: [b][size=4]Question 1: The circuit board of the STM32F072C8T6 + BQ76930 + BQ78350 solution has been completed, and it is ready to connect the battery for testing and development. The function of the c...; qwqwqw2088 Analogue and Mixed Signal

What does this PCB package marking mean?: This is the package diagram of REF2933. I don't know what the 3 in front of 3×0.50/0.30 means. Please tell me, thank you!...; chenbingjy PCB Design

Problems found during PCB rule checking: I found the following problems, how to fix them, many of them are like this, this is the component I chose, why does it say I am wrong:Sad:...; Hubble林 PCB Design

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components