HYS64T32000LM-3.7-A datasheet, PDF

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HYS64T32000LM-3.7-A: DescriptionDDR DRAM Module, 32MX64, 0.5ns, CMOS, LEAD FREE, MICRO, DIMM-214; Categorystorage storage; File Size955KB，31 Pages; ManufacturerInfineon; Websitehttp://www.infineon.com/; Environmental Compliance

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HYS64T32000LM-3.7-A Overview

DDR DRAM Module, 32MX64, 0.5ns, CMOS, LEAD FREE, MICRO, DIMM-214

HYS64T32000LM-3.7-A Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Infineon
Parts packaging code	DIMM
package instruction	DIMM, DIMM214,16
Contacts	214
Reach Compliance Code	compliant
ECCN code	EAR99
access mode	SINGLE BANK PAGE BURST
Maximum access time	0.5 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	266 MHz
I/O type	COMMON
JESD-30 code	R-XDMA-N214
memory density	2147483648 bit
Memory IC Type	DDR DRAM MODULE
memory width	64
Number of functions	1
Number of ports	1
Number of terminals	214
word count	33554432 words
character code	32000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	65 °C
Minimum operating temperature
organize	32MX64
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	DIMM
Encapsulate equivalent code	DIMM214,16
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	1.8 V
Certification status	Not Qualified
refresh cycle	8192
self refresh	YES
Maximum standby current	0.016 A
Maximum slew rate	0.88 mA
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	0.4 mm
Terminal location	DUAL

HYS64T32000LM-3.7-A Related Products

	HYS64T32000LM-3.7-A	HYS64T32000KM-3.7-A	HYS64T64020LM-3.7-A	HYS64T64020KM-3.7-A
Description	DDR DRAM Module, 32MX64, 0.5ns, CMOS, LEAD FREE, MICRO, DIMM-214	DDR DRAM Module, 32MX64, 0.5ns, CMOS, MICRO, DIMM-214	DDR DRAM Module, 64MX64, 0.5ns, CMOS, LEAD FREE, MICRO, DIMM-214	DDR DRAM Module, 64MX64, 0.5ns, CMOS, MICRO, DIMM-214
Is it Rohs certified?	conform to	incompatible	conform to	incompatible
Parts packaging code	DIMM	DIMM	DIMM	DIMM
package instruction	DIMM, DIMM214,16	DIMM, DIMM214,16	DIMM, DIMM214,16	DIMM, DIMM214,16
Contacts	214	214	214	214
Reach Compliance Code	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99
access mode	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST
Maximum access time	0.5 ns	0.5 ns	0.5 ns	0.5 ns
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	266 MHz	266 MHz	266 MHz	266 MHz
I/O type	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XDMA-N214	R-XDMA-N214	R-XDMA-N214	R-XDMA-N214
memory density	2147483648 bit	2147483648 bit	4294967296 bit	4294967296 bit
Memory IC Type	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE
memory width	64	64	64	64
Number of functions	1	1	1	1
Number of ports	1	1	1	1
Number of terminals	214	214	214	214
word count	33554432 words	33554432 words	67108864 words	67108864 words
character code	32000000	32000000	64000000	64000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	65 °C	65 °C	65 °C	65 °C
organize	32MX64	32MX64	64MX64	64MX64
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM	DIMM	DIMM
Encapsulate equivalent code	DIMM214,16	DIMM214,16	DIMM214,16	DIMM214,16
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
power supply	1.8 V	1.8 V	1.8 V	1.8 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	8192	8192	8192	8192
self refresh	YES	YES	YES	YES
Maximum standby current	0.016 A	0.016 A	0.032 A	0.032 A
Maximum slew rate	0.88 mA	0.88 mA	0.896 mA	0.896 mA
Maximum supply voltage (Vsup)	1.9 V	1.9 V	1.9 V	1.9 V
Minimum supply voltage (Vsup)	1.7 V	1.7 V	1.7 V	1.7 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	0.4 mm	0.4 mm	0.4 mm	0.4 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maker	Infineon	-	Infineon	Infineon

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