MT8JTF25664AIY-1G4XX datasheet, PDF

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MT8JTF25664AIY-1G4XX: DescriptionDDR DRAM Module, 256MX64, CMOS, LEAD FREE, UDIMM-240; Categorystorage storage; File Size326KB，13 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/; Environmental Compliance

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MT8JTF25664AIY-1G4XX Overview

DDR DRAM Module, 256MX64, CMOS, LEAD FREE, UDIMM-240

MT8JTF25664AIY-1G4XX Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Micron Technology
Parts packaging code	DIMM
package instruction	LEAD FREE, UDIMM-240
Contacts	240
Reach Compliance Code	compliant
ECCN code	EAR99
access mode	SINGLE BANK PAGE BURST
Other features	SELF CONTAINED REFRESH
JESD-30 code	R-XDMA-N240
JESD-609 code	e4
memory density	17179869184 bit
Memory IC Type	DDR DRAM MODULE
memory width	64
Number of functions	1
Number of ports	1
Number of terminals	240
word count	268435456 words
character code	256000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256MX64
Package body material	UNSPECIFIED
encapsulated code	DIMM
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
self refresh	YES
Maximum supply voltage (Vsup)	1.575 V
Minimum supply voltage (Vsup)	1.425 V
Nominal supply voltage (Vsup)	1.5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Gold (Au)
Terminal form	NO LEAD
Terminal location	DUAL
Maximum time at peak reflow temperature	30

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1GB, 2GB (x64, SR) 240-Pin DDR3 SDRAM UDIMM

Features

DDR3 SDRAM UDIMM

MT8JTF12864AY – 1GB

MT8JTF25664AY – 2GB

Features

•

DDR3 functionality and operations supported as

defined in the component data sheet

•

240-pin, unbuffered dual in-line memory module

(UDIMM)

•

Fast data transfer rates: PC3-12800, PC3-10600,

PC3-8500, or PC3-6400

•

1GB (128 Meg x 64), 2GB (256 Meg x 64)

•

= V

DDQ

= +1.5V ±0.075V

•

DDSPD

= +3.0V to +3.6V

•

Reset pin for improved system stability

•

Nominal and dynamic on-die termination (ODT) for

data, strobe, and mask signals

•

Single rank

•

Fixed burst chop (BC) of 4 and burst length (BL) of 8

via the mode register set (MRS)

•

Adjustable data-output drive strength

•

Serial presence-detect (SPD) EEPROM

•

Gold edge contacts

•

Lead-free

•

Fly-by topology

•

Terminated control, command, and address bus

Table 1: Key Timing Parameters

Speed

Grade

-1G6

-1G4

-1G1

-1G0

-80B

Industry

Nomenclature

PC3-12800

PC3-10600

PC3-8500

PC3-6400

Data Rate (MT/s)

CL = 11 CL = 10

1600

–

1333

–

CL = 9

1333

–

CL = 8

1066

–

CL = 7

1066

–

CL = 6

800

CL = 5

667

RCD

Figure 1: 240-Pin UDIMM (MO-269 R/C A)

Module height: 30mm (1.18in)

Options

•

Operating temperature

–

Commercial (0°C

≤

+70°C)

–

Industrial (–40°C

≤

+85°C)

•

Package

–

240-pin DIMM (lead-free)

•

Frequency/CAS latency

–

1.25ns @ CL = 11 (DDR3-1600)

–

1.5ns @ CL = 9 (DDR3-1333)

–

1.87ns @ CL = 7 (DDR3-1066)

–

1.87ns @ CL = 8 (DDR3-1066)

–

2.5ns @ CL = 5 (DDR3-800)

–

2.5ns @ CL = 6 (DDR3-800)

Notes:

Marking

None

-1G6

-1G4

-1G1

-1G0

-80C

-80B

1. Contact Micron for industrial temperature

module offerings.

2. Not recommended for new designs.

(ns)

13.125

(ns)

13.125

(ns)

48.125

49.125

50.625

52.5

PDF: 09005aef82b21119

jtf8c128_256x64ay.pdf – Rev. D 2/11 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

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