Standard SRAM, 32KX8, 120ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | SHARP |
package instruction | 0.600 INCH, PLASTIC, DIP-28 |
Reach Compliance Code | unknown |
Maximum access time | 120 ns |
JESD-30 code | R-PDIP-T28 |
JESD-609 code | e0 |
length | 36 mm |
memory density | 262144 bit |
Memory IC Type | STANDARD SRAM |
memory width | 8 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 28 |
word count | 32768 words |
character code | 32000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 32KX8 |
Output characteristics | 3-STATE |
Exportable | YES |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
Maximum seat height | 5.2 mm |
Minimum standby current | 2 V |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 15.24 mm |
LH51256-12 | LH51256N-10 | LH51256N-12 | LH51256-10 | |
---|---|---|---|---|
Description | Standard SRAM, 32KX8, 120ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Standard SRAM, 32KX8, 100ns, CMOS, PDSO28, 0.450 INCH, PLASTIC, SOP-28 | Standard SRAM, 32KX8, 120ns, CMOS, PDSO28, 0.450 INCH, PLASTIC, SOP-28 | Standard SRAM, 32KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
package instruction | 0.600 INCH, PLASTIC, DIP-28 | 0.450 INCH, PLASTIC, SOP-28 | 0.450 INCH, PLASTIC, SOP-28 | 0.600 INCH, PLASTIC, DIP-28 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
Maximum access time | 120 ns | 100 ns | 120 ns | 100 ns |
JESD-30 code | R-PDIP-T28 | R-PDSO-G28 | R-PDSO-G28 | R-PDIP-T28 |
JESD-609 code | e0 | e0 | e0 | e0 |
length | 36 mm | 18 mm | 18 mm | 36 mm |
memory density | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
memory width | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 | 1 |
Number of terminals | 28 | 28 | 28 | 28 |
word count | 32768 words | 32768 words | 32768 words | 32768 words |
character code | 32000 | 32000 | 32000 | 32000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C |
organize | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Exportable | YES | YES | YES | YES |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | SOP | SOP | DIP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 5.2 mm | 2.6 mm | 2.6 mm | 5.2 mm |
Minimum standby current | 2 V | 2 V | 2 V | 2 V |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | YES | YES | NO |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 15.24 mm | 8.6 mm | 8.6 mm | 15.24 mm |
Maker | SHARP | - | SHARP | SHARP |