DS2143 datasheet, PDF - EEWORLD Datasheet

DS2143: DescriptionDATACOM, FRAMER, PDIP40, 0.600 INCH, DIP-40; CategoryWireless rf/communication Telecom circuit; File Size1MB，45 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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DATACOM, FRAMER, PDIP40, 0.600 INCH, DIP-40

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Rochester Electronics
Parts packaging code	DIP
package instruction	DIP,
Contacts	40
Reach Compliance Code	unknown
JESD-30 code	R-PDIP-T40
JESD-609 code	e0
length	52.075 mm
Humidity sensitivity level	1
Number of functions	1
Number of terminals	40
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	240
Certification status	COMMERCIAL
Maximum seat height	5.08 mm
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Telecom integrated circuit types	FRAMER
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	20
width	15.24 mm

	DS2143	DS2143Q
Description	DATACOM, FRAMER, PDIP40, 0.600 INCH, DIP-40	DATACOM, FRAMER, PQCC44, PLASTIC, LCC-44
Is it lead-free?	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible
Maker	Rochester Electronics	Rochester Electronics
Parts packaging code	DIP	LCC
package instruction	DIP,	QCCJ,
Contacts	40	44
Reach Compliance Code	unknown	unknown
JESD-30 code	R-PDIP-T40	S-PQCC-J44
JESD-609 code	e0	e0
length	52.075 mm	16.585 mm
Humidity sensitivity level	1	3
Number of functions	1	1
Number of terminals	40	44
Maximum operating temperature	70 °C	70 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	QCCJ
Package shape	RECTANGULAR	SQUARE
Package form	IN-LINE	CHIP CARRIER
Peak Reflow Temperature (Celsius)	240	240
Certification status	COMMERCIAL	COMMERCIAL
Maximum seat height	5.08 mm	4.57 mm
Nominal supply voltage	5 V	5 V
surface mount	NO	YES
technology	CMOS	CMOS
Telecom integrated circuit types	FRAMER	FRAMER
Temperature level	COMMERCIAL	COMMERCIAL
Terminal surface	TIN LEAD	TIN LEAD
Terminal form	THROUGH-HOLE	J BEND
Terminal pitch	2.54 mm	1.27 mm
Terminal location	DUAL	QUAD
Maximum time at peak reflow temperature	20	20
width	15.24 mm	16.585 mm

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