Fast Page DRAM, 4MX4, 60ns, CMOS, PDSO24
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | LAPIS Semiconductor Co., Ltd. |
| package instruction | TSOP, TSOP24/26,.36 |
| Reach Compliance Code | unknown |
| Maximum access time | 60 ns |
| I/O type | COMMON |
| JESD-30 code | R-PDSO-G24 |
| JESD-609 code | e0 |
| memory density | 16777216 bit |
| Memory IC Type | FAST PAGE DRAM |
| memory width | 4 |
| Number of terminals | 24 |
| word count | 4194304 words |
| character code | 4000000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 4MX4 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSOP |
| Encapsulate equivalent code | TSOP24/26,.36 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| refresh cycle | 2048 |
| self refresh | NO |
| Maximum standby current | 0.0005 A |
| Maximum slew rate | 0.09 mA |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| MSM51V17400D-60TS-K | MSM51V17400D-70TS-K | MSM51V17400D-50SJ | MSM51V17400DSL-70TS-K | MSM51V17400D-70SJ | MSM51V17400DSL-60TS-K | |
|---|---|---|---|---|---|---|
| Description | Fast Page DRAM, 4MX4, 60ns, CMOS, PDSO24 | Fast Page DRAM, 4MX4, 70ns, CMOS, PDSO24 | Fast Page DRAM, 4MX4, 50ns, CMOS, PDSO24 | Fast Page DRAM, 4MX4, 70ns, CMOS, PDSO24, | Fast Page DRAM, 4MX4, 70ns, CMOS, PDSO24 | Fast Page DRAM, 4MX4, 60ns, CMOS, PDSO24, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | TSOP, TSOP24/26,.36 | TSOP, TSOP24/26,.36 | SOJ, SOJ24/26,.34 | TSOP, TSOP24/26,.36 | SOJ, SOJ24/26,.34 | TSOP, TSOP24/26,.36 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow |
| Maximum access time | 60 ns | 70 ns | 50 ns | 70 ns | 70 ns | 60 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-J24 | R-PDSO-G24 | R-PDSO-J24 | R-PDSO-G24 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bi |
| Memory IC Type | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM |
| memory width | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of terminals | 24 | 24 | 24 | 24 | 24 | 24 |
| word count | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
| character code | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 4MX4 | 4MX4 | 4MX4 | 4MX4 | 4MX4 | 4MX4 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSOP | TSOP | SOJ | TSOP | SOJ | TSOP |
| Encapsulate equivalent code | TSOP24/26,.36 | TSOP24/26,.36 | SOJ24/26,.34 | TSOP24/26,.36 | SOJ24/26,.34 | TSOP24/26,.36 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE |
| power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| refresh cycle | 2048 | 2048 | 2048 | 2048 | 2048 | 2048 |
| self refresh | NO | NO | NO | YES | NO | YES |
| Maximum standby current | 0.0005 A | 0.0005 A | 0.0005 A | 0.0002 A | 0.0005 A | 0.0002 A |
| Maximum slew rate | 0.09 mA | 0.08 mA | 0.1 mA | 0.08 mA | 0.08 mA | 0.09 mA |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING | J BEND | GULL WING | J BEND | GULL WING |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | LAPIS Semiconductor Co., Ltd. | - | LAPIS Semiconductor Co., Ltd. | LAPIS Semiconductor Co., Ltd. | LAPIS Semiconductor Co., Ltd. | LAPIS Semiconductor Co., Ltd. |
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