Memory Circuit, 64KX16, CMOS, PBGA48, 8 X 8 MM, 0.75 MM PITCH, ROHS COMPLIANT, FBGA-48
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Everspin Technologies |
Parts packaging code | BGA |
package instruction | LFBGA, BGA48,6X8,30 |
Contacts | 48 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Maximum access time | 35 ns |
JESD-30 code | S-PBGA-B48 |
length | 8 mm |
memory density | 1048576 bit |
Memory IC Type | MEMORY CIRCUIT |
memory width | 16 |
Mixed memory types | N/A |
Number of functions | 1 |
Number of terminals | 48 |
word count | 65536 words |
character code | 64000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 64KX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | LFBGA |
Encapsulate equivalent code | BGA48,6X8,30 |
Package shape | SQUARE |
Package form | GRID ARRAY, LOW PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum seat height | 1.35 mm |
Maximum standby current | 0.012 A |
Maximum slew rate | 0.165 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | BALL |
Terminal pitch | 0.75 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 8 mm |
MR0A16ACMA35 | MR0A16AYS35 | MR0A16ACYS35 | MR0A16ACYS35R | MR0A16ACMA35R | MR0A16AVMA35 | |
---|---|---|---|---|---|---|
Description | Memory Circuit, 64KX16, CMOS, PBGA48, 8 X 8 MM, 0.75 MM PITCH, ROHS COMPLIANT, FBGA-48 | Memory Circuit, 64KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44 | Memory Circuit, 64KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44 | Memory Circuit, 64KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44 | Memory Circuit, 64KX16, CMOS, PBGA48, 8 X 8 MM, 0.75 MM PITCH, ROHS COMPLIANT, FBGA-48 | Memory Circuit, 64KX16, CMOS, PBGA48, 8 X 8 MM, 0.75 MM PITCH, ROHS COMPLIANT, FBGA-48 |
Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to |
Parts packaging code | BGA | TSOP2 | TSOP2 | TSOP2 | BGA | BGA |
package instruction | LFBGA, BGA48,6X8,30 | TSOP2, TSOP44,.46,32 | TSOP2, TSOP44,.46,32 | TSOP2, TSOP44,.46,32 | LFBGA, BGA48,6X8,30 | LFBGA, BGA48,6X8,30 |
Contacts | 48 | 44 | 44 | 44 | 48 | 48 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | 35 ns | 35 ns | 35 ns | 35 ns | 35 ns | 35 ns |
JESD-30 code | S-PBGA-B48 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 | S-PBGA-B48 | S-PBGA-B48 |
length | 8 mm | 18.41 mm | 18.41 mm | 18.41 mm | 8 mm | 8 mm |
memory density | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
Memory IC Type | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT |
memory width | 16 | 16 | 16 | 16 | 16 | 16 |
Mixed memory types | N/A | N/A | N/A | N/A | N/A | N/A |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 48 | 44 | 44 | 44 | 48 | 48 |
word count | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
character code | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C | 105 °C |
Minimum operating temperature | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C |
organize | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | LFBGA | TSOP2 | TSOP2 | TSOP2 | LFBGA | LFBGA |
Encapsulate equivalent code | BGA48,6X8,30 | TSOP44,.46,32 | TSOP44,.46,32 | TSOP44,.46,32 | BGA48,6X8,30 | BGA48,6X8,30 |
Package shape | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
Package form | GRID ARRAY, LOW PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.35 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.35 mm | 1.35 mm |
Maximum standby current | 0.012 A | 0.028 A | 0.028 A | 0.012 A | 0.012 A | 0.012 A |
Maximum slew rate | 0.165 mA | 0.155 mA | 0.165 mA | 0.165 mA | 0.165 mA | 0.165 mA |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal form | BALL | GULL WING | GULL WING | GULL WING | BALL | BALL |
Terminal pitch | 0.75 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.75 mm | 0.75 mm |
Terminal location | BOTTOM | DUAL | DUAL | DUAL | BOTTOM | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 8 mm | 10.16 mm | 10.16 mm | 10.16 mm | 8 mm | 8 mm |