IC,RF MODULATOR,CMOS,LLCC,36PIN,PLASTIC
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | conform to |
Maker | Texas Instruments |
package instruction | QCCN, LCC36,.25SQ,20 |
Reach Compliance Code | unknown |
JESD-30 code | S-PQCC-N36 |
JESD-609 code | e4 |
Humidity sensitivity level | 3 |
Number of terminals | 36 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCN |
Encapsulate equivalent code | LCC36,.25SQ,20 |
Package shape | SQUARE |
Package form | CHIP CARRIER |
power supply | 2.5/3.3 V |
Certification status | Not Qualified |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal form | NO LEAD |
Terminal pitch | 0.5 mm |
Terminal location | QUAD |
CC2510F8RSPG3 | CC2510F16RSPRG3 | CC2510F16RSPG3 | CC2510F32RSPRG3 | PCC2510F32RSPR | CC2510F8RSPRG3 | |
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Description | IC,RF MODULATOR,CMOS,LLCC,36PIN,PLASTIC | TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC36, 6 X 6 MM, GREEN, MO-220, QFN-36 | TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC36, 6 X 6 MM, GREEN, MO-220, QFN-36 | TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC36, 6 X 6 MM, GREEN, MO-220, QFN-36 | IC,RF MODULATOR,CMOS,LLCC,36PIN,PLASTIC | IC,RF MODULATOR,CMOS,LLCC,36PIN,PLASTIC |
Is it lead-free? | Contains lead | Lead free | Lead free | Lead free | Contains lead | Contains lead |
Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to |
Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
package instruction | QCCN, LCC36,.25SQ,20 | HVQCCN, LCC36,.25SQ,20 | HVQCCN, LCC36,.25SQ,20 | HVQCCN, LCC36,.25SQ,20 | QCCN, LCC36,.25SQ,20 | QCCN, LCC36,.25SQ,20 |
Reach Compliance Code | unknown | compliant | compliant | compliant | unknown | unknown |
JESD-30 code | S-PQCC-N36 | S-XQCC-N36 | S-XQCC-N36 | S-XQCC-N36 | S-PQCC-N36 | S-PQCC-N36 |
Number of terminals | 36 | 36 | 36 | 36 | 36 | 36 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
Package body material | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | QCCN | HVQCCN | HVQCCN | HVQCCN | QCCN | QCCN |
Encapsulate equivalent code | LCC36,.25SQ,20 | LCC36,.25SQ,20 | LCC36,.25SQ,20 | LCC36,.25SQ,20 | LCC36,.25SQ,20 | LCC36,.25SQ,20 |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | CHIP CARRIER | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER | CHIP CARRIER |
power supply | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
surface mount | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
Terminal pitch | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
JESD-609 code | e4 | e4 | e4 | e4 | - | e4 |
Humidity sensitivity level | 3 | 3 | 3 | 3 | - | 3 |
Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) |