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CC2510F8RSPG3

Description
IC,RF MODULATOR,CMOS,LLCC,36PIN,PLASTIC
CategoryWireless rf/communication    Telecom circuit   
File Size4MB,245 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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CC2510F8RSPG3 Overview

IC,RF MODULATOR,CMOS,LLCC,36PIN,PLASTIC

CC2510F8RSPG3 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?conform to
MakerTexas Instruments
package instructionQCCN, LCC36,.25SQ,20
Reach Compliance Codeunknown
JESD-30 codeS-PQCC-N36
JESD-609 codee4
Humidity sensitivity level3
Number of terminals36
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeQCCN
Encapsulate equivalent codeLCC36,.25SQ,20
Package shapeSQUARE
Package formCHIP CARRIER
power supply2.5/3.3 V
Certification statusNot Qualified
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationQUAD

CC2510F8RSPG3 Related Products

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Description IC,RF MODULATOR,CMOS,LLCC,36PIN,PLASTIC TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC36, 6 X 6 MM, GREEN, MO-220, QFN-36 TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC36, 6 X 6 MM, GREEN, MO-220, QFN-36 TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC36, 6 X 6 MM, GREEN, MO-220, QFN-36 IC,RF MODULATOR,CMOS,LLCC,36PIN,PLASTIC IC,RF MODULATOR,CMOS,LLCC,36PIN,PLASTIC
Is it lead-free? Contains lead Lead free Lead free Lead free Contains lead Contains lead
Is it Rohs certified? conform to conform to conform to conform to conform to conform to
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
package instruction QCCN, LCC36,.25SQ,20 HVQCCN, LCC36,.25SQ,20 HVQCCN, LCC36,.25SQ,20 HVQCCN, LCC36,.25SQ,20 QCCN, LCC36,.25SQ,20 QCCN, LCC36,.25SQ,20
Reach Compliance Code unknown compliant compliant compliant unknown unknown
JESD-30 code S-PQCC-N36 S-XQCC-N36 S-XQCC-N36 S-XQCC-N36 S-PQCC-N36 S-PQCC-N36
Number of terminals 36 36 36 36 36 36
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY UNSPECIFIED UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QCCN HVQCCN HVQCCN HVQCCN QCCN QCCN
Encapsulate equivalent code LCC36,.25SQ,20 LCC36,.25SQ,20 LCC36,.25SQ,20 LCC36,.25SQ,20 LCC36,.25SQ,20 LCC36,.25SQ,20
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form CHIP CARRIER CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER CHIP CARRIER
power supply 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD
JESD-609 code e4 e4 e4 e4 - e4
Humidity sensitivity level 3 3 3 3 - 3
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) - Nickel/Palladium/Gold (Ni/Pd/Au)

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