CC2510F16RSPRG3 datasheet, PDF

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CC2510F16RSPRG3: DescriptionTELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC36, 6 X 6 MM, GREEN, MO-220, QFN-36; CategoryWireless rf/communication Telecom circuit; File Size4MB，245 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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CC2510F16RSPRG3 Overview

TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC36, 6 X 6 MM, GREEN, MO-220, QFN-36

CC2510F16RSPRG3 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	QFN
package instruction	HVQCCN, LCC36,.25SQ,20
Contacts	36
Reach Compliance Code	compliant
JESD-30 code	S-XQCC-N36
JESD-609 code	e4
length	6 mm
Humidity sensitivity level	3
Number of functions	1
Number of terminals	36
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	UNSPECIFIED
encapsulated code	HVQCCN
Encapsulate equivalent code	LCC36,.25SQ,20
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260
power supply	2.5/3.3 V
Certification status	Not Qualified
Maximum seat height	0.9 mm
Nominal supply voltage	3 V
surface mount	YES
technology	CMOS
Telecom integrated circuit types	RF AND BASEBAND CIRCUIT
Temperature level	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	6 mm

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Description	TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC36, 6 X 6 MM, GREEN, MO-220, QFN-36	TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC36, 6 X 6 MM, GREEN, MO-220, QFN-36	TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC36, 6 X 6 MM, GREEN, MO-220, QFN-36	IC,RF MODULATOR,CMOS,LLCC,36PIN,PLASTIC	IC,RF MODULATOR,CMOS,LLCC,36PIN,PLASTIC	IC,RF MODULATOR,CMOS,LLCC,36PIN,PLASTIC
Is it lead-free?	Lead free	Lead free	Lead free	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	HVQCCN, LCC36,.25SQ,20	HVQCCN, LCC36,.25SQ,20	HVQCCN, LCC36,.25SQ,20	QCCN, LCC36,.25SQ,20	QCCN, LCC36,.25SQ,20	QCCN, LCC36,.25SQ,20
Reach Compliance Code	compliant	compliant	compliant	unknown	unknown	unknown
JESD-30 code	S-XQCC-N36	S-XQCC-N36	S-XQCC-N36	S-PQCC-N36	S-PQCC-N36	S-PQCC-N36
Number of terminals	36	36	36	36	36	36
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HVQCCN	HVQCCN	HVQCCN	QCCN	QCCN	QCCN
Encapsulate equivalent code	LCC36,.25SQ,20	LCC36,.25SQ,20	LCC36,.25SQ,20	LCC36,.25SQ,20	LCC36,.25SQ,20	LCC36,.25SQ,20
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
power supply	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
JESD-609 code	e4	e4	e4	-	e4	e4
Humidity sensitivity level	3	3	3	-	3	3
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	-	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)

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