FIFO, 256X18, 15ns, Synchronous, CMOS, PQCC68, PLASTIC, LCC-68
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Cypress Semiconductor |
| Parts packaging code | LCC |
| package instruction | PLASTIC, LCC-68 |
| Contacts | 68 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Maximum access time | 15 ns |
| Other features | RETRANSMIT |
| Maximum clock frequency (fCLK) | 40 MHz |
| period time | 25 ns |
| JESD-30 code | S-PQCC-J68 |
| JESD-609 code | e0 |
| length | 24.2316 mm |
| memory density | 4608 bit |
| Memory IC Type | OTHER FIFO |
| memory width | 18 |
| Number of functions | 1 |
| Number of terminals | 68 |
| word count | 256 words |
| character code | 256 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256X18 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC68,1.0SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum standby current | 0.006 A |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 24.2316 mm |
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