Cache SRAM Module, 1MX8, 15ns, CMOS
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | ALSC [Alliance Semiconductor Corporation] |
package instruction | DIMM, DIMM160 |
Reach Compliance Code | unknown |
ECCN code | 3A991.B.2.A |
Maximum access time | 15 ns |
I/O type | COMMON |
JESD-30 code | X-XXMA-X160 |
memory density | 8388608 bit |
Memory IC Type | CACHE SRAM MODULE |
memory width | 8 |
Humidity sensitivity level | 1 |
Number of functions | 1 |
Number of terminals | 160 |
word count | 1048576 words |
character code | 1000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 1MX8 |
Output characteristics | 3-STATE |
Package body material | UNSPECIFIED |
encapsulated code | DIMM |
Encapsulate equivalent code | DIMM160 |
Package shape | UNSPECIFIED |
Package form | MICROELECTRONIC ASSEMBLY |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 225 |
power supply | 5 V |
Certification status | Not Qualified |
Maximum standby current | 0.08 A |
Minimum standby current | 4.5 V |
Maximum slew rate | 0.96 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | UNSPECIFIED |
Terminal pitch | 1.27 mm |
Terminal location | UNSPECIFIED |
Maximum time at peak reflow temperature | NOT SPECIFIED |
AS7M64P1024-15C | AS7M64P256-10C | AS7M64P256-12C | AS7M64P1024-20C | AS7M64P512-20C | AS7M64P256-15C | AS7M64P256-20C | |
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Description | Cache SRAM Module, 1MX8, 15ns, CMOS | Cache SRAM Module, 256KX8, 10ns, CMOS | Cache SRAM Module, 256KX8, 12ns, CMOS | Cache SRAM Module, 1MX8, 20ns, CMOS | Cache SRAM Module, 512KX8, 20ns, CMOS | Cache SRAM Module, 256KX8, 15ns, CMOS | Cache SRAM Module, 256KX8, 20ns, CMOS |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
package instruction | DIMM, DIMM160 | DIMM, DIMM160 | DIMM, DIMM160 | DIMM, DIMM160 | DIMM, DIMM160 | DIMM, DIMM160 | DIMM, DIMM160 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN code | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
Maximum access time | 15 ns | 10 ns | 12 ns | 20 ns | 20 ns | 15 ns | 20 ns |
I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | X-XXMA-X160 | X-XXMA-X160 | X-XXMA-X160 | X-XXMA-X160 | X-XXMA-X160 | X-XXMA-X160 | X-XXMA-X160 |
memory density | 8388608 bit | 2097152 bit | 2097152 bit | 8388608 bit | 4194304 bit | 2097152 bit | 2097152 bit |
Memory IC Type | CACHE SRAM MODULE | CACHE SRAM MODULE | CACHE SRAM MODULE | CACHE SRAM MODULE | CACHE SRAM MODULE | CACHE SRAM MODULE | CACHE SRAM MODULE |
memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Humidity sensitivity level | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 160 | 160 | 160 | 160 | 160 | 160 | 160 |
word count | 1048576 words | 262144 words | 262144 words | 1048576 words | 524288 words | 262144 words | 262144 words |
character code | 1000000 | 256000 | 256000 | 1000000 | 512000 | 256000 | 256000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 1MX8 | 256KX8 | 256KX8 | 1MX8 | 512KX8 | 256KX8 | 256KX8 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
encapsulated code | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
Encapsulate equivalent code | DIMM160 | DIMM160 | DIMM160 | DIMM160 | DIMM160 | DIMM160 | DIMM160 |
Package shape | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | 225 | 225 | 225 | 225 | 225 | 225 | 225 |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum standby current | 0.08 A | 0.016 A | 0.016 A | 0.08 A | 0.04 A | 0.016 A | 0.016 A |
Minimum standby current | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Maximum slew rate | 0.96 mA | 0.96 mA | 0.92 mA | 0.88 mA | 0.84 mA | 0.88 mA | 0.8 mA |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Maker | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | - | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] |