Flash, 256KX16, 90ns, PBGA48, PLASTIC, FBGA-48
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | FUJITSU |
package instruction | PLASTIC, FBGA-48 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 90 ns |
Other features | CONFIGURABLE AS 512K X 8 |
Spare memory width | 8 |
startup block | TOP |
command user interface | YES |
Data polling | YES |
JESD-30 code | R-PBGA-B48 |
JESD-609 code | e0 |
length | 8 mm |
memory density | 4194304 bit |
Memory IC Type | FLASH |
memory width | 16 |
Number of functions | 1 |
Number of departments/size | 2,4,2,6 |
Number of terminals | 48 |
word count | 262144 words |
character code | 256000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 256KX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TFBGA |
Encapsulate equivalent code | BGA48,6X8,32 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
power supply | 3/3.3 V |
Programming voltage | 3 V |
Certification status | Not Qualified |
ready/busy | YES |
Maximum seat height | 1.2 mm |
Department size | 16K,8K,32K,64K |
Maximum standby current | 0.000005 A |
Maximum slew rate | 0.045 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
switch bit | YES |
type | NOR TYPE |
width | 6 mm |
MBM29DL400TC-90PBT | MBM29DL400TC-55PFTN | MBM29DL400TC-70PBT | MBM29DL400TC-90PFTR | MBM29DL400BC-55PBT | MBM29DL400BC-70PFTR | MBM29DL400BC-55PFTR | |
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Description | Flash, 256KX16, 90ns, PBGA48, PLASTIC, FBGA-48 | Flash, 256KX16, 55ns, PDSO48, PLASTIC, TSOP1-48 | Flash, 256KX16, 70ns, PBGA48, PLASTIC, FBGA-48 | Flash, 256KX16, 90ns, PDSO48, PLASTIC, REVERSE, TSOP1-48 | Flash, 256KX16, 55ns, PBGA48, PLASTIC, FBGA-48 | Flash, 256KX16, 70ns, PDSO48, PLASTIC, REVERSE, TSOP1-48 | Flash, 256KX16, 55ns, PDSO48, PLASTIC, REVERSE, TSOP1-48 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
package instruction | PLASTIC, FBGA-48 | PLASTIC, TSOP1-48 | PLASTIC, FBGA-48 | PLASTIC, REVERSE, TSOP1-48 | TFBGA, BGA48,6X8,32 | PLASTIC, REVERSE, TSOP1-48 | PLASTIC, REVERSE, TSOP1-48 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | 90 ns | 55 ns | 70 ns | 90 ns | 55 ns | 70 ns | 55 ns |
Other features | CONFIGURABLE AS 512K X 8 | CONFIGURABLE AS 512K X 8 | CONFIGURABLE AS 512K X 8 | CONFIGURABLE AS 512K X 8 | CONFIGURABLE AS 512K X 8 | CONFIGURABLE AS 512K X 8 | CONFIGURABLE AS 512K X 8 |
Spare memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
startup block | TOP | TOP | TOP | TOP | BOTTOM | BOTTOM | BOTTOM |
command user interface | YES | YES | YES | YES | YES | YES | YES |
Data polling | YES | YES | YES | YES | YES | YES | YES |
JESD-30 code | R-PBGA-B48 | R-PDSO-G48 | R-PBGA-B48 | R-PDSO-G48 | R-PBGA-B48 | R-PDSO-G48 | R-PDSO-G48 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
length | 8 mm | 18.4 mm | 8 mm | 18.4 mm | 8 mm | 18.4 mm | 18.4 mm |
memory density | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
Memory IC Type | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
memory width | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of departments/size | 2,4,2,6 | 2,4,2,6 | 2,4,2,6 | 2,4,2,6 | 2,4,2,6 | 2,4,2,6 | 2,4,2,6 |
Number of terminals | 48 | 48 | 48 | 48 | 48 | 48 | 48 |
word count | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
character code | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 85 °C | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C | 70 °C |
Minimum operating temperature | -40 °C | -20 °C | -40 °C | -40 °C | -20 °C | -40 °C | -20 °C |
organize | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | TFBGA | TSOP1 | TFBGA | TSOP1-R | TFBGA | TSOP1-R | TSOP1-R |
Encapsulate equivalent code | BGA48,6X8,32 | TSSOP48,.8,20 | BGA48,6X8,32 | TSSOP48,.8,20 | BGA48,6X8,32 | TSSOP48,.8,20 | TSSOP48,.8,20 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | GRID ARRAY, THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE | GRID ARRAY, THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE | GRID ARRAY, THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
power supply | 3/3.3 V | 3.3 V | 3/3.3 V | 3/3.3 V | 3.3 V | 3/3.3 V | 3.3 V |
Programming voltage | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
ready/busy | YES | YES | YES | YES | YES | YES | YES |
Maximum seat height | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
Department size | 16K,8K,32K,64K | 16K,8K,32K,64K | 16K,8K,32K,64K | 16K,8K,32K,64K | 16K,8K,32K,64K | 16K,8K,32K,64K | 16K,8K,32K,64K |
Maximum standby current | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A |
Maximum slew rate | 0.045 mA | 0.045 mA | 0.045 mA | 0.045 mA | 0.045 mA | 0.045 mA | 0.045 mA |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V | 3 V | 2.7 V | 2.7 V | 3 V | 2.7 V | 3 V |
Nominal supply voltage (Vsup) | 3 V | 3.3 V | 3 V | 3 V | 3.3 V | 3 V | 3.3 V |
surface mount | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | BALL | GULL WING | BALL | GULL WING | BALL | GULL WING | GULL WING |
Terminal pitch | 0.8 mm | 0.5 mm | 0.8 mm | 0.5 mm | 0.8 mm | 0.5 mm | 0.5 mm |
Terminal location | BOTTOM | DUAL | BOTTOM | DUAL | BOTTOM | DUAL | DUAL |
switch bit | YES | YES | YES | YES | YES | YES | YES |
type | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
width | 6 mm | 12 mm | 6 mm | 12 mm | 6 mm | 12 mm | 12 mm |
Maker | FUJITSU | - | FUJITSU | FUJITSU | FUJITSU | FUJITSU | FUJITSU |
Parts packaging code | - | TSOP1 | - | TSOP1 | - | TSOP1 | TSOP1 |
Contacts | - | 48 | - | 48 | - | 48 | 48 |