High power density, high efficiency, low profile shielded drum
core power inductors
Product specifications
Part Number
DR124-R47-R
DR124-1R0-R
DR124-1R5-R
DR124-2R2-R
DR124-3R9-R
DR124-4R7-R
DR124-6R8-R
DR124-8R2-R
DR124-100-R
DR124-120-R
DR124-150-R
DR124-180-R
DR124-220-R
DR124-270-R
DR124-330-R
DR124-390-R
DR124-470-R
DR124-560-R
DR124-680-R
DR124-820-R
DR124-101-R
DR124-121-R
DR124-151-R
DR124-181-R
DR124-221-R
DR124-271-R
DR124-331-R
DR124-471-R
DR124-681-R
DR124-821-R
DR124-102-R
Rated
Inductance
(μH)
0.47
1.0
1.5
2.2
3.9
4.7
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
470
680
820
1000
OCL
μH±20%
1
I
rms
(A)
2
I
sat
(A)
3
DCR
mΩ @20°C
Typ
2.2
3.00
4.75
5.92
12.50
13.50
18.06
21.67
23.33
31.67
37.30
46.97
53.99
66.67
80.83
110.00
124.66
144.32
183.33
212.72
256.67
311.18
371.02
501.66
558.00
725.00
825.00
1242.50
1845.83
2109.17
2898.00
DCR
mΩ @
+20°C
Max
2.7
3.6
5.7
7.1
15.0
16.2
21.7
26.0
28.0
38.0
44.8
56.4
64.8
80.0
97.0
132.0
149.6
173.2
220.0
255.3
308.0
373.4
445.2
602.0
669.6
870.0
990.0
1491.0
2215.0
2351.0
3477.00
K-factor
4
17.51
12.50
9.73
7.96
5.84
5.15
4.61
4.17
3.81
3.50
3.02
2.82
2.50
2.24
2.04
1.86
1.72
1.54
1.39
1.27
1.17
1.08
0.94
0.87
0.77
0.71
0.63
0.53
0.45
0.40
0.37
0.42
0.83
1.37
2.04
3.80
4.88
6.10
7.45
8.94
11.5
14.2
16.2
20.7
25.7
31.2
37.3
44.0
54.9
67.1
80.5
95.1
111
146
179
216
256
327
460
669
825
998
16.0
13.9
11.1
9.1
7.0
6.5
5.6
5.2
4.5
4.1
3.6
3.4
3.2
2.8
2.6
2.3
2.2
2.0
1.8
1.7
1.5
1.3
1.3
1.1
1.0
0.88
0.83
0.68
0.56
0.53
0.44
24.40
18.00
14.00
11.45
8.40
7.65
6.47
6.22
5.80
4.96
4.62
4.32
3.83
3.44
3.12
2.85
2.63
2.35
2.13
1.94
1.79
1.65
1.44
1.30
1.15
1.09
0.92
0.74
0.65
0.62
0.53
1.
Open Circuit Inductance Test Parameters: 100 kHz, 0.25 V, 0.0 Adc.
2.
I
rms
: DC current for an approximate
∆T
of 40 °C without core loss. Derating is
necessary for AC currents. PCB layout, trace thickness and width, air-flow,
and proximity of other heat generating components will affect the
temperature rise. It is recommended that the temperature of the part not
exceed
+125
°C under worst case operating conditions verified in the end
application.
3.
I
sat
Amps peak for approximately 25% rolloff (@
+25
°C).
4. K-factor: Used to determine B
p-p
for core loss (see graph).
B
p-p
= K*L*∆I, B
p-p
(mT), K: (K factor from table), L: (Inductance in μH),
∆I
(Peak to peak ripple current in Amps).
5. Part Number Definition: DR124-xxx-R
- DR124 = Product code and size; -xxx = Inductance value in uH;
- R = decimal point; If no R is present, third character = # of zeros.
- “-R” suffix = RoHS compliant
2
www.eaton.com/electronics
DR124
High power density, high efficiency, low profile shielded drum
core power inductors
Dimensions- mm
BOTTOM VIEW
FRONT VIEW
TOP VIEW
Technical Data
4141
Effective
September
2017
RECOMMENDED PCB LAYOUT
SCHEMATIC
2.05
Typ.
13.8
5.00
1
Typ
2
12.50
Max
4.5
Max
12.50
Max
1
1
DR124-###
wwllyy R
2
5.50
2
10
3.85
Dimensions are in millimeters.
wwlly = Date code, R = Revision level.
Packaging- mm
1.5 dia
+0.1/-0.0
4.0
1.5 dia
min
A
1.75
11
Ao=13.2 mm
Bo=13.2 mm
A1=10mm
B1=10 mm
Ko=5.2 mm
12.6
Bo
B
1
24.0
Ko
A1
Ao
DR124-###
wwllyy R
16.0
A
SECTION A-A
Parts packaged on 13" Diameter reel, 750 parts per reel.
User direction of feed
Temperature rise vs. total loss
120
100
Temperature Rise (°C)
80
60
40
20
0
0
0.4
0.8
1.2
1.6
2
Total Pow er Loss (W)
www.eaton.com/electronics
3
Technical Data
4141
Effective
September
2017
DR124
High power density, high efficiency, low profile shielded drum
core power inductors
Core loss
vs. Bp-p
100
10
1 MHz
500 kHz
300 kHz
200 kHz
100 kHz
1
Core Loss (W)
0.1
0.01
0.001
0.0001
1
10
100
1000
Bp-p (m T)
Inductance characteristics
OCL vs. I
sat
120.0
100.0
+85 °C
80.0
% OCL
60.0
+25 °C
40.0
-40 °C
20.0
0.0
0.0
20.0
40.0
60.0
80.0
100.0
120.0
% I
sat
4
www.eaton.com/electronics
DR124
High power density, high efficiency, low profile shielded drum
core power inductors
Solder reflow profile
T
P
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
C
-5°C
Technical Data
4141
Effective
September
2017
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5mm)
≥2.5mm
T
smax
235°C
220°C
220°C
220°C
Temperature
Table 2 - Lead (Pb) Free Solder (Tc)
T
smin
t
s
Package
Thickness
Volume
mm
3
<350
Volume
mm
3
350 - 2000
Volume
mm
3
>2000
<1.6mm
1.6 – 2.5mm
>2.5mm
25°C
Time 25°C to Peak
260°C
260°C
250°C
260°C
250°C
245°C
260°C
245°C
245°C
Time
Reference JDEC J-STD-020
Profile Feature
Standard SnPb Solder
Lead (Pb) Free Solder
Preheat and Soak
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
100°C
150°C
60-120 Seconds
3°C/ Second Max.
183°C
60-150 Seconds
Table 1
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
150°C
200°C
60-120 Seconds
3°C/ Second Max.
217°C
60-150 Seconds
Table 2
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
Average ramp up rate Tsmax to Tp
Liquidous temperature (T
l
)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
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