Microprocessor Circuit, CMOS, PBGA16, 1.93 X 2.07 MM, 0.60 MM HEIGHT, HALOGEN FREE AND LEAD FREE, WLP-16
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | ABLIC |
Parts packaging code | BGA |
package instruction | 1.93 X 2.07 MM, 0.60 MM HEIGHT, HALOGEN FREE AND LEAD FREE, WLP-16 |
Contacts | 16 |
Reach Compliance Code | compliant |
JESD-30 code | R-PBGA-B16 |
length | 2.07 mm |
Number of terminals | 16 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | VFBGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | 260 |
Certification status | Not Qualified |
Maximum seat height | 0.6 mm |
Maximum supply voltage | 4.5 V |
Minimum supply voltage | 2.3 V |
Nominal supply voltage | 3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | BALL |
Terminal pitch | 0.5 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 10 |
width | 1.93 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR CIRCUIT |