REVISION CQ
DO NOT
SCALE FROM
THIS PRINT
CLP-1XX-XX-XXX-D-XX
1. C REPRESENTS A CRITICAL DIMENSION
2. MINIMUM PUSHOUT FORCE: .5LB (8 OZ)
3. ONE POSITON WILL BE LOST FOR EVERY CUT MADE ON A
No OF POSITIONS PER ROW
SOCKET STRIP
-02 THRU -50
4. TUBE PACKAGE POSITIONS 5-50 ONLY. POSITIONS 2-4 ARE
TO BE LAYERED PACKAGED.
5. SHEAR TAILS TO DIMENSIONS SHOWN
LEAD STYLE SPEC
6. PARTS TO BE SYMMETRICAL ABOUT C WITHIN ±.0015[0.038]. -02: SURFACE MOUNT
L
7. ENDWALL AFTER CUTTING: .0185[0.470]±.0025[0.064]
(USE C-106-X2-XXX)
8. VOID CORES MAY NOT BE PRESENT.
(SEE NOTE 9)
9. HAND FILL USE C-106-01-XX.
AUTOMATION USE C-106-22-XX.
C-106-02-XX CAN BE
C
SUBBED FOR C-106-22-XX.
C
10. MAX CUT FLASH: .010[0.27] WITH NO FLASH ALLOWED IN
.0100 0.254
HOLES OR EXTENDING BELOW LEADS.
.005 0.12
C
11. MAX BURR: .005[.13].
OPTION
-P: PICK & PLACE PAD (USE LMP-01)
(AVAILABLE ON POSITON -05 THRU -50 ONLY)
(NOT AVAILABLE WITH -PA OR -K OPTIONS)
(SEE FIG 3, SHT 2)
-A: ALIGNMENT PIN (USE CLP-XX-D-XX)
(NOT AVAILABLE WITH -PA OPTION)
(SEE FIG 3, SHT 2)
-TR: TAPE AND REEL
-BE: BOTTOM ENTRY ONLY (USE CLP-XX-DBE-XX)
-PA: PICK & PLACE PAD WITH ALIGNMENT PINS
(NOT AVAILABLE WITH -P, -A, OR -K OPTIONS)
(SEE SHT 2, TABLE 3)
-K: POLYIMIDE FILM PAD (AVAILABLE ON -05 THRU -50
POSITIONS. USE K-DOT-.157-.250-.005, (SEE FIG 5, SHT 2)
(NOT AVAILABLE WITH -P OR -PA OPTIONS)
BODY SPEC
-D: DOUBLE ROW
(USE CLP-XX-D)
DETAIL 'D'
SCALE 16 : 1
No OF POS x .0500[1.270]) - .0500[1.270]
(TOLERANCE ACCUM ±.0020[0.051])
.034 0.85
REF
C
(No OF POS X .0500[1.270]) + .017[0.43]±.008[0.20]
(SEE NOTE 3 AND 7)
'D'
02
.120 3.05
REF
01
-D
-D-BE
PLATING SPEC
-F: 3µ" FLASH SELECTIVE GOLD IN CONTACT AREA
MATTE TIN ON TAIL
-L: 10µ" LIGHT SELECTIVE GOLD IN CONTACT AREA
MATTE TIN ON TAIL
-S: 30µ" SELECTIVE GOLD IN CONTACT AREA
MATTE TIN ON TAIL
-G: 10µ" GOLD IN CONTACT AREA
3µ ON TAIL
-H: 30µ" HEAVY GOLD IN CONTACT AREA
3µ" ON TAIL
-LM: 10µ" LIGHT SELECTIVE GOLD IN CONTACT AREA
MATTE TIN ON TAIL
-FM: 3µ" FLASH SELECTIVE GOLD IN CONTACT AREA
MATTE TIN ON TAIL
-SM: 30µ" SELECTIVE GOLD IN CONTACT AREA
MATTE TIN ON TAIL
-LTL: 10µ" LIGHT SELECTIVE GOLD IN CONTACT AREA
TIN/LEAD (90/10+/-5%) TAIL
CLP-XX-D-XX
CLP-XX-DBE-XX
C
"A"
.084 2.12 REF
"B"
"B"
-D-BE
.090
- .001
2.29
- 0.03
(MEASURE AT BEND)
-A-
C C
L L
.170±.010 4.31±0.25
+.003
+0.08
.050 1.27 REF
+4
.004[[0.10] POS. 02-35
.006[0.15] POS. 36-50
-3
"A"
-D
.016 0.41 x .005[0.13] REF
SECTION "B"-"B"
(-D-BE BODY: CLP-XX-DBE-XX)
(DIFFERENT AS SHOWN,
OTHERWISE SAME AS -D BODY)
2.5 MAX SWAY
(TYP)
C
(-D BODY: CLP-XX-D-XX)
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS
SECTION "A"-"A"
C-106-22-XXX
88°
REF
90°
-D
-D-BE
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
.010 0.25
.012 0.30
.XX: .01 [.3]
2
.XXX: .005 [.13]
.XXXX: .0020 [.051]
ANGLES
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
MATERIAL:
DO NOT SCALE DRAWING
SHEET SCALE: 3:1
LOW PROFILE .050 x .050 DOUBLE ROW ASM
DWG. NO.
DESCRIPTION:
IN-PROCESS
SCALE 8:1
FIG 1
INSULATOR: LCP, UL 94 VO, COLOR: BLACK
CONTACT: PHOS BRONZE
F:\DWG\MISC\MKTG\CLP-1XX-XX-XXX-D-XX-MKT.SLDDRW
CLP-1XX-XX-XXX-D-XX
01/31/1994
SHEET
1
OF
3
BY:
PURVIS
REVISION CQ
C
AVAILABLE ON POSITIONS 05 THRU 50 ONLY
NOTE: "N" = USED MEASURED DIMENSION (REF)
"Q" = [("N" - .250[6.35])/2] ±.020[0.51]
"N" (SEE NOTE)
C
"Q" 3.45
(SEE NOTE)
.100 2.54
.019 0.47
.005 X 45° REF (TYP 4 SIDES)
(No OF POS x .0500[1.270]) - .100[2.54] 22.86
LMP-01
.250 6.35 REF
.0070 0.178
REF (TYP)
.025 0.6350 REF (TYP)
.0100 0.254 REF (TYP)
.0050 0.127 REF (TYP)
-A: ALIGNMENT PIN
(3 POSITION MINIMUM)
(NOT AVAILABLE WITH -PA OPTION)
(DIFFERENT AS SHOWN, OTHERWISE SAME AS FIG 1)
.121 3.07
"A"
.051 1.30
C
C
FIG 2
-P: PICK AND PLACE PAD
(AVAILABLE ON POSITION 05 THRU 50 ONLY)
(NOT AVAILABLE WITH -PA OR -K OPTIONS)
FIG 3
"R"
(SEE NOTE)
.019±.015 0.48±0.38
.035 0.89 REF
.325 8.26
REF
C
"T"
PPP-38-X-X-XX
.275 6.99
"S"
(SEE NOTE)
C
.095 2.41
.1575±.0050 4.000±0.127
-PA: PICK & PLACE PAD WITH ALIGNMENT PINS
(NOT AVAILABLE WITH -P, -A OR -K OPTIONS)
FIG 4
-K: POLYIMIDE FILM PAD
(AVAILABLE ON POSITION 05 THRU 50 ONLY)
(NOT AVAILABLE WITH -P OR -PA OPTIONS)
NOTE: "R" = USED MEASURED DIMENSION (REF)
"S" = {("R" - .1575[4.000])/2} ±.020[0.51]
FIG 5
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DO NOT SCALE DRAWING
SHEET SCALE: 4:1
LOW PROFILE .050 x .050 DOUBLE ROW ASM
DWG. NO.
DESCRIPTION:
CLP-1XX-XX-XXX-D-XX
01/31/1994
SHEET
2
OF
3
F:\DWG\MISC\MKTG\CLP-1XX-XX-XXX-D-XX-MKT.SLDDRW
BY:
PURVIS
REVISION CQ
(SEE NOTE 4, SHEET 1)
PACKAGING
PT-CLP001-PA
PT-CLX-002-D
PT-CLX-001-D
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DESCRIPTION:
DWG. NO.
DO NOT SCALE DRAWING
SHEET SCALE: 4:1
LOW PROFILE .050 x .050 DOUBLE ROW ASM
CLP-1XX-XX-XXX-D-XX
01/31/1994
SHEET
3
OF
3
F:\DWG\MISC\MKTG\CLP-1XX-XX-XXX-D-XX-MKT.SLDDRW
BY:
PURVIS
Microcontroller MCU
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