IS27C512-15WI datasheet, PDF - EEWORLD Datasheet

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IS27C512-15WI: DescriptionOTP ROM, 64KX8, 150ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28; Categorystorage storage; File Size400KB，11 Pages; ManufacturerIntegrated Silicon Solution ( ISSI )

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IS27C512-15WI Overview

OTP ROM, 64KX8, 150ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28

IS27C512-15WI Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Integrated Silicon Solution ( ISSI )
Parts packaging code	DIP
package instruction	0.600 INCH, PLASTIC, DIP-28
Contacts	28
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	150 ns
JESD-30 code	R-PDIP-T28
JESD-609 code	e0
length	36.576 mm
memory density	524288 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	28
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	64KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	4.699 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm

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	IS27C512-15WI	IS27C512-12WI	IS27C512-90WI	IS27C512-90CW	IS27C512-90CWI	IS27C512-15CW	IS27C512-15CWI	IS27C512-12CW	IS27C512-12CWI
Description	OTP ROM, 64KX8, 150ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	OTP ROM, 64KX8, 120ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	OTP ROM, 64KX8, 90ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	UVPROM, 64KX8, 90ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28	UVPROM, 64KX8, 90ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28	UVPROM, 64KX8, 150ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28	UVPROM, 64KX8, 150ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28	UVPROM, 64KX8, 120ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28	UVPROM, 64KX8, 120ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )
Parts packaging code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
package instruction	0.600 INCH, PLASTIC, DIP-28	0.600 INCH, PLASTIC, DIP-28	0.600 INCH, PLASTIC, DIP-28	0.600 INCH, WINDOWED, CERAMIC, DIP-28	0.600 INCH, WINDOWED, CERAMIC, DIP-28	0.600 INCH, WINDOWED, CERAMIC, DIP-28	0.600 INCH, WINDOWED, CERAMIC, DIP-28	0.600 INCH, WINDOWED, CERAMIC, DIP-28	0.600 INCH, WINDOWED, CERAMIC, DIP-28
Contacts	28	28	28	28	28	28	28	28	28
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	150 ns	120 ns	90 ns	90 ns	90 ns	150 ns	150 ns	120 ns	120 ns
JESD-30 code	R-PDIP-T28	R-PDIP-T28	R-PDIP-T28	R-GDIP-T28	R-GDIP-T28	R-GDIP-T28	R-GDIP-T28	R-GDIP-T28	R-GDIP-T28
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
memory density	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM
memory width	8	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	28	28	28	28	28	28	28	28	28
word count	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
character code	64000	64000	64000	64000	64000	64000	64000	64000	64000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	70 °C	85 °C	70 °C	85 °C	70 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-	-40 °C	-	-40 °C	-	-40 °C
organize	64KX8	64KX8	64KX8	64KX8	64KX8	64KX8	64KX8	64KX8	64KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DIP	DIP	WDIP	WDIP	WDIP	WDIP	WDIP	WDIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE, WINDOW	IN-LINE, WINDOW	IN-LINE, WINDOW	IN-LINE, WINDOW	IN-LINE, WINDOW	IN-LINE, WINDOW
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

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