FIFO, 32KX9, 6.5ns, Synchronous, CMOS, PQFP64, STQFP-64
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | QFP |
package instruction | STQFP-64 |
Contacts | 64 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Maximum access time | 6.5 ns |
Other features | RETRANSMIT; AUTO POWER DOWN |
period time | 10 ns |
JESD-30 code | S-PQFP-G64 |
JESD-609 code | e0 |
length | 10 mm |
memory density | 294912 bit |
memory width | 9 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 64 |
word count | 32768 words |
character code | 32000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 32KX9 |
Exportable | YES |
Package body material | PLASTIC/EPOXY |
encapsulated code | LFQFP |
Package shape | SQUARE |
Package form | FLATPACK, LOW PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 240 |
Certification status | Not Qualified |
Maximum seat height | 1.6 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | TIN LEAD |
Terminal form | GULL WING |
Terminal pitch | 0.5 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 20 |
width | 10 mm |