Line Driver/Receiver, 4 Driver, BIPolar, CDFP16
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | DFP, FL16,.3 |
| Reach Compliance Code | unknown |
| Differential output | YES |
| Number of drives | 4 |
| High level input current maximum value | 0.00002 A |
| JESD-30 code | R-XDFP-F16 |
| JESD-609 code | e0 |
| Number of terminals | 16 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Minimum output swing | 2 V |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL16,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | BIPOLAR |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| maximum transmission delay | 20 ns |
| DS26LS31MW/883 | AM26LS31/B2A | AM26LS31/BFA | AM26LS31MF | DS26LS31MJ/883 | |
|---|---|---|---|---|---|
| Description | Line Driver/Receiver, 4 Driver, BIPolar, CDFP16 | Line Driver/Receiver, 4 Driver, BIPolar, CQCC20 | Line Driver/Receiver, 4 Driver, BIPolar, CDFP16 | Line Driver/Receiver, 4 Driver, BIPolar, CDIP16, | Line Driver/Receiver, 4 Driver, BIPolar, CDIP16 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DFP, FL16,.3 | QCCN, LCC20,.35SQ | DFP, FL16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| Differential output | YES | YES | YES | YES | YES |
| Number of drives | 4 | 4 | 4 | 4 | 4 |
| High level input current maximum value | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A |
| JESD-30 code | R-XDFP-F16 | S-XQCC-N20 | R-XDFP-F16 | R-XDIP-T16 | R-XDIP-T16 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 16 | 20 | 16 | 16 | 16 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Minimum output swing | 2 V | 2 V | 2 V | 2 V | 2 V |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DFP | QCCN | DFP | DIP | DIP |
| Encapsulate equivalent code | FL16,.3 | LCC20,.35SQ | FL16,.3 | DIP16,.3 | DIP16,.3 |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | CHIP CARRIER | FLATPACK | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | NO | NO |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | NO LEAD | FLAT | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | QUAD | DUAL | DUAL | DUAL |
| maximum transmission delay | 20 ns | 30 ns | 30 ns | 20 ns | 20 ns |
| Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | - | 38535Q/M;38534H;883B |
| Base Number Matches | - | 1 | 1 | 1 | - |
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