72T18115L5BBI datasheet, PDF - EEWORLD Datasheet

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72T18115L5BBI: DescriptionPBGA-240, Tray; Categorystorage storage; File Size458KB，57 Pages; ManufacturerIDT (Integrated Device Technology)

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72T18115L5BBI Overview

PBGA-240, Tray

72T18115L5BBI Parametric

Parameter Name	Attribute value
Brand Name	Integrated Device Technology
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
Parts packaging code	PBGA
package instruction	BGA, BGA240,18X18,40
Contacts	240
Manufacturer packaging code	BB240
Reach Compliance Code	not_compliant
ECCN code	EAR99
Samacsys Description	PBGA 19.0 X 19.0 MM X 1.0 MM PITCH
Maximum access time	3.6 ns
Other features	ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE
Spare memory width	9
Maximum clock frequency (fCLK)	83 MHz
period time	5 ns
JESD-30 code	S-PBGA-B240
JESD-609 code	e0
length	19 mm
memory density	4718592 bit
Memory IC Type	OTHER FIFO
memory width	18
Humidity sensitivity level	3
Number of functions	1
Number of terminals	240
word count	262144 words
character code	256000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256KX18
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA240,18X18,40
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	2.5 V
Certification status	Not Qualified
Maximum seat height	1.97 mm
Maximum standby current	0.02 A
Maximum slew rate	0.07 mA
Maximum supply voltage (Vsup)	2.625 V
Minimum supply voltage (Vsup)	2.375 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn63Pb37)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	20
width	19 mm

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