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N82S23D

Description
IC 32 X 8 OTPROM, 50 ns, PDSO16, Programmable ROM
Categorystorage    storage   
File Size75KB,3 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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N82S23D Overview

IC 32 X 8 OTPROM, 50 ns, PDSO16, Programmable ROM

N82S23D Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNXP
package instructionSOP, SOP16,.4
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time50 ns
JESD-30 codeR-PDSO-G16
JESD-609 codee0
memory density256 bit
Memory IC TypeOTP ROM
memory width8
Number of functions1
Number of terminals16
word count32 words
character code32
Operating modeASYNCHRONOUS
Maximum operating temperature75 °C
Minimum operating temperature
organize32X8
Output characteristicsOPEN-COLLECTOR
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP16,.4
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum slew rate0.096 mA
Maximum supply voltage (Vsup)5.25 V
Minimum supply voltage (Vsup)4.75 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyBIPOLAR
Temperature levelCOMMERCIAL EXTENDED
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED

N82S23D Related Products

N82S23D N82S123NB N82S23NB RCA121043R0FKEBAP
Description IC 32 X 8 OTPROM, 50 ns, PDSO16, Programmable ROM IC 32 X 8 OTPROM, 50 ns, PDIP16, Programmable ROM IC 32 X 8 OTPROM, 50 ns, PDIP16, Programmable ROM Fixed Resistor, Metal Glaze/thick Film, 0.5W, 43ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1210, CHIP
Is it Rohs certified? incompatible incompatible incompatible conform to
package instruction SOP, SOP16,.4 DIP, DIP16,.3 DIP, DIP16,.3 CHIP
Reach Compliance Code unknown unknow unknow compliant
ECCN code EAR99 EAR99 EAR99 EAR99
JESD-609 code e0 e0 e0 e4
Number of terminals 16 16 16 2
Maximum operating temperature 75 °C 75 °C 75 °C 155 °C
Package form SMALL OUTLINE IN-LINE IN-LINE SMT
surface mount YES NO NO YES
technology BIPOLAR BIPOLAR BIPOLAR METAL GLAZE/THICK FILM
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Silver/Palladium (Ag/Pd)
Maximum access time 50 ns 50 ns 50 ns -
JESD-30 code R-PDSO-G16 R-PDIP-T16 R-PDIP-T16 -
memory density 256 bit 256 bi 256 bi -
Memory IC Type OTP ROM OTP ROM OTP ROM -
memory width 8 8 8 -
Number of functions 1 1 1 -
word count 32 words 32 words 32 words -
character code 32 32 32 -
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS -
organize 32X8 32X8 32X8 -
Output characteristics OPEN-COLLECTOR 3-STATE OPEN-COLLECTOR -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code SOP DIP DIP -
Encapsulate equivalent code SOP16,.4 DIP16,.3 DIP16,.3 -
Package shape RECTANGULAR RECTANGULAR RECTANGULAR -
Parallel/Serial PARALLEL PARALLEL PARALLEL -
power supply 5 V 5 V 5 V -
Certification status Not Qualified Not Qualified Not Qualified -
Maximum slew rate 0.096 mA 0.096 mA 0.096 mA -
Maximum supply voltage (Vsup) 5.25 V 5.25 V 5.25 V -
Minimum supply voltage (Vsup) 4.75 V 4.75 V 4.75 V -
Nominal supply voltage (Vsup) 5 V 5 V 5 V -
Temperature level COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED -
Terminal form GULL WING THROUGH-HOLE THROUGH-HOLE -
Terminal pitch 1.27 mm 2.54 mm 2.54 mm -
Terminal location DUAL DUAL DUAL -

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