IC 32 X 8 OTPROM, 50 ns, PDSO16, Programmable ROM
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | NXP |
package instruction | SOP, SOP16,.4 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 50 ns |
JESD-30 code | R-PDSO-G16 |
JESD-609 code | e0 |
memory density | 256 bit |
Memory IC Type | OTP ROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 16 |
word count | 32 words |
character code | 32 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 75 °C |
Minimum operating temperature | |
organize | 32X8 |
Output characteristics | OPEN-COLLECTOR |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Encapsulate equivalent code | SOP16,.4 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum slew rate | 0.096 mA |
Maximum supply voltage (Vsup) | 5.25 V |
Minimum supply voltage (Vsup) | 4.75 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | BIPOLAR |
Temperature level | COMMERCIAL EXTENDED |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
N82S23D | N82S123NB | N82S23NB | RCA121043R0FKEBAP | |
---|---|---|---|---|
Description | IC 32 X 8 OTPROM, 50 ns, PDSO16, Programmable ROM | IC 32 X 8 OTPROM, 50 ns, PDIP16, Programmable ROM | IC 32 X 8 OTPROM, 50 ns, PDIP16, Programmable ROM | Fixed Resistor, Metal Glaze/thick Film, 0.5W, 43ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1210, CHIP |
Is it Rohs certified? | incompatible | incompatible | incompatible | conform to |
package instruction | SOP, SOP16,.4 | DIP, DIP16,.3 | DIP, DIP16,.3 | CHIP |
Reach Compliance Code | unknown | unknow | unknow | compliant |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
JESD-609 code | e0 | e0 | e0 | e4 |
Number of terminals | 16 | 16 | 16 | 2 |
Maximum operating temperature | 75 °C | 75 °C | 75 °C | 155 °C |
Package form | SMALL OUTLINE | IN-LINE | IN-LINE | SMT |
surface mount | YES | NO | NO | YES |
technology | BIPOLAR | BIPOLAR | BIPOLAR | METAL GLAZE/THICK FILM |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Silver/Palladium (Ag/Pd) |
Maximum access time | 50 ns | 50 ns | 50 ns | - |
JESD-30 code | R-PDSO-G16 | R-PDIP-T16 | R-PDIP-T16 | - |
memory density | 256 bit | 256 bi | 256 bi | - |
Memory IC Type | OTP ROM | OTP ROM | OTP ROM | - |
memory width | 8 | 8 | 8 | - |
Number of functions | 1 | 1 | 1 | - |
word count | 32 words | 32 words | 32 words | - |
character code | 32 | 32 | 32 | - |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - |
organize | 32X8 | 32X8 | 32X8 | - |
Output characteristics | OPEN-COLLECTOR | 3-STATE | OPEN-COLLECTOR | - |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
encapsulated code | SOP | DIP | DIP | - |
Encapsulate equivalent code | SOP16,.4 | DIP16,.3 | DIP16,.3 | - |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | - |
power supply | 5 V | 5 V | 5 V | - |
Certification status | Not Qualified | Not Qualified | Not Qualified | - |
Maximum slew rate | 0.096 mA | 0.096 mA | 0.096 mA | - |
Maximum supply voltage (Vsup) | 5.25 V | 5.25 V | 5.25 V | - |
Minimum supply voltage (Vsup) | 4.75 V | 4.75 V | 4.75 V | - |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | - |
Temperature level | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | - |
Terminal form | GULL WING | THROUGH-HOLE | THROUGH-HOLE | - |
Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | - |
Terminal location | DUAL | DUAL | DUAL | - |