RF and Baseband Circuit, PDSO14, PLASTIC, SO-14
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Motorola ( NXP ) |
| package instruction | SOP, |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDSO-G14 |
| JESD-609 code | e0 |
| length | 8.65 mm |
| Number of functions | 1 |
| Number of terminals | 14 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 1.75 mm |
| Nominal supply voltage | 3 V |
| surface mount | YES |
| Telecom integrated circuit types | RF AND BASEBAND CIRCUIT |
| Temperature level | INDUSTRIAL |
| Terminal surface | TIN LEAD |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 3.9 mm |
| MC13141D | MC13141DR2 | MC13141D1 | MC13141D1R2 | MC13141FTB | |
|---|---|---|---|---|---|
| Description | RF and Baseband Circuit, PDSO14, PLASTIC, SO-14 | RF and Baseband Circuit, PDSO14, PLASTIC, SO-14 | TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PDSO8, PLASTIC, SO-8 | TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PDSO8, PLASTIC, SO-8 | TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PQFP20, TQFP-20 |
| Maker | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
| package instruction | SOP, | SOP, | SOP, | SOP, | LQFP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G8 | R-PDSO-G8 | S-PQFP-G20 |
| length | 8.65 mm | 8.65 mm | 4.9 mm | 4.9 mm | 4 mm |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 14 | 14 | 8 | 8 | 20 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | SOP | SOP | SOP | LQFP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | FLATPACK, LOW PROFILE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.6 mm |
| Nominal supply voltage | 3 V | 3 V | 3 V | 3 V | 3 V |
| surface mount | YES | YES | YES | YES | YES |
| Telecom integrated circuit types | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | QUAD |
| width | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 4 mm |
| Is it Rohs certified? | incompatible | - | incompatible | - | incompatible |
| JESD-609 code | e0 | - | e0 | - | e0 |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED |
| Terminal surface | TIN LEAD | - | TIN LEAD | - | TIN LEAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED |
| Parts packaging code | - | - | SOIC | SOIC | QFP |
| Contacts | - | - | 8 | 8 | 20 |
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