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MPC8541CPXAQDX

Description
32-BIT, 1600MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, BGA-360
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,84 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric View All

MPC8541CPXAQDX Overview

32-BIT, 1600MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, BGA-360

MPC8541CPXAQDX Parametric

Parameter NameAttribute value
MakerNXP
Parts packaging codeBGA
package instructionBGA,
Contacts360
Reach Compliance Codeunknown
ECCN code3A001.A.3
Other featuresLOW POWER TAKEN FROM SLEEP MODE
Address bus width36
bit size32
boundary scanYES
maximum clock frequency200 MHz
External data bus width64
FormatFLOATING POINT
Integrated cacheYES
JESD-30 codeS-CBGA-B360
length25 mm
low power modeYES
Number of terminals360
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Certification statusNot Qualified
Maximum seat height2.4 mm
speed1600 MHz
Maximum supply voltage1.3 V
Minimum supply voltage1.2 V
Nominal supply voltage1.25 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
width25 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
Freescale Semiconductor
Technical Data
MPC8541EEC
Rev. 4, 12/2006
MPC8541E PowerQUICC™ III
Integrated Communications Processor
Hardware Specifications
The MPC8541E integrates a PowerPC™ processor core
built on Power Architecture™ technology with system logic
required for networking, telecommunications, and wireless
infrastructure applications. The MPC8541E is a member of
the PowerQUICC™ III family of devices that combine
system-level support for industry-standard interfaces with
processors that implement the embedded category of the
Power Architecture technology. For functional
characteristics of the processor, refer to the
MPC8555E
PowerQUICC™ III Integrated Communications Processor
Reference Manual.
To locate any published errata or updates for this document
refer to http://www.freescale.com or contact your Freescale
sales office.
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Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 7
Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 11
Clock Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . 14
DDR SDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Ethernet: Three-Speed, MII Management . . . . . . . . . . 20
Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
CPM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . . . 53
Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
System Design Information . . . . . . . . . . . . . . . . . . . . . 75
Document Revision History . . . . . . . . . . . . . . . . . . . . 82
Device Nomenclature . . . . . . . . . . . . . . . . . . . . . . . . . 82
© Freescale Semiconductor, Inc., 2004, 2004, 2006. All rights reserved.
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