|
MT48H8M16LFB4-8IT:J |
MT48H8M16LFB4-8IT:JTR |
MT48H8M16LFB4-10:J |
MT48H8M16LFB4-10IT:J |
Description |
Synchronous DRAM, 8MX16, 7ns, CMOS, PBGA54, 8 X 8 MM, LEAD FREE, VFBGA-54 |
Synchronous DRAM, 8MX16, 6ns, CMOS, PBGA54, 8 X 8 MM, LEAD FREE, VFBGA-54 |
Synchronous DRAM, 8MX16, 7ns, CMOS, PBGA54, 8 X 8 MM, LEAD FREE, VFBGA-54 |
Synchronous DRAM, 8MX16, 7ns, CMOS, PBGA54, 8 X 8 MM, LEAD FREE, VFBGA-54 |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
Maker |
Micron Technology |
Micron Technology |
Micron Technology |
Micron Technology |
Parts packaging code |
BGA |
BGA |
BGA |
BGA |
package instruction |
8 X 8 MM, LEAD FREE, VFBGA-54 |
8 X 8 MM, LEAD FREE, VFBGA-54 |
VFBGA, |
VFBGA, |
Contacts |
54 |
54 |
54 |
54 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
access mode |
FOUR BANK PAGE BURST |
FOUR BANK PAGE BURST |
FOUR BANK PAGE BURST |
FOUR BANK PAGE BURST |
Maximum access time |
7 ns |
6 ns |
7 ns |
7 ns |
Other features |
AUTO/SELF REFRESH |
AUTO/SELF REFRESH |
AUTO/SELF REFRESH |
AUTO/SELF REFRESH |
JESD-30 code |
S-PBGA-B54 |
S-PBGA-B54 |
S-PBGA-B54 |
S-PBGA-B54 |
JESD-609 code |
e1 |
e1 |
e1 |
e1 |
length |
8 mm |
8 mm |
8 mm |
8 mm |
memory density |
134217728 bit |
134217728 bit |
134217728 bit |
134217728 bit |
Memory IC Type |
SYNCHRONOUS DRAM |
SYNCHRONOUS DRAM |
SYNCHRONOUS DRAM |
SYNCHRONOUS DRAM |
memory width |
16 |
16 |
16 |
16 |
Number of functions |
1 |
1 |
1 |
1 |
Number of ports |
1 |
1 |
1 |
1 |
Number of terminals |
54 |
54 |
54 |
54 |
word count |
8388608 words |
8388608 words |
8388608 words |
8388608 words |
character code |
8000000 |
8000000 |
8000000 |
8000000 |
Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
Maximum operating temperature |
85 °C |
85 °C |
70 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
- |
-40 °C |
organize |
8MX16 |
8MX16 |
8MX16 |
8MX16 |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
VFBGA |
VFBGA |
VFBGA |
VFBGA |
Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
Package form |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
260 |
260 |
260 |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1 mm |
1 mm |
1 mm |
1 mm |
self refresh |
YES |
YES |
YES |
YES |
Maximum supply voltage (Vsup) |
1.95 V |
1.95 V |
1.95 V |
1.95 V |
Minimum supply voltage (Vsup) |
1.7 V |
1.7 V |
1.7 V |
1.7 V |
Nominal supply voltage (Vsup) |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
surface mount |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
COMMERCIAL |
INDUSTRIAL |
Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form |
BALL |
BALL |
BALL |
BALL |
Terminal pitch |
0.8 mm |
0.8 mm |
0.8 mm |
0.8 mm |
Terminal location |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
30 |
30 |
30 |
width |
8 mm |
8 mm |
8 mm |
8 mm |
Is it lead-free? |
- |
Lead free |
Lead free |
Lead free |