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HN62302BP-17

Description
MASK ROM, 256KX8, 170ns, CMOS, PDIP32, PLASTIC, DIP-32
Categorystorage    storage   
File Size90KB,4 Pages
ManufacturerHitachi (Renesas )
Websitehttp://www.renesas.com/eng/
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HN62302BP-17 Overview

MASK ROM, 256KX8, 170ns, CMOS, PDIP32, PLASTIC, DIP-32

HN62302BP-17 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerHitachi (Renesas )
Parts packaging codeDIP
package instructionDIP, DIP32,.6
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time170 ns
JESD-30 codeR-PDIP-T32
JESD-609 codee0
length41.9 mm
memory density2097152 bit
Memory IC TypeMASK ROM
memory width8
Number of functions1
Number of terminals32
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX8
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP32,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum standby current0.00003 A
Maximum slew rate0.05 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width15.24 mm

HN62302BP-17 Related Products

HN62302BP-17 HN62302BF-17 HN62302BF-20 HN62302BP-20
Description MASK ROM, 256KX8, 170ns, CMOS, PDIP32, PLASTIC, DIP-32 MASK ROM, 256KX8, 170ns, CMOS, PDSO32, PLASTIC, SOP-32 MASK ROM, 256KX8, 200ns, CMOS, PDSO32, PLASTIC, SOP-32 MASK ROM, 256KX8, 200ns, CMOS, PDIP32, PLASTIC, DIP-32
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas )
Parts packaging code DIP SOIC SOIC DIP
package instruction DIP, DIP32,.6 SOP, SOP32,.56 SOP, SOP32,.56 DIP, DIP32,.6
Contacts 32 32 32 32
Reach Compliance Code unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99
Maximum access time 170 ns 170 ns 200 ns 200 ns
JESD-30 code R-PDIP-T32 R-PDSO-G32 R-PDSO-G32 R-PDIP-T32
JESD-609 code e0 e0 e0 e0
length 41.9 mm 20.45 mm 20.45 mm 41.9 mm
memory density 2097152 bit 2097152 bit 2097152 bit 2097152 bit
Memory IC Type MASK ROM MASK ROM MASK ROM MASK ROM
memory width 8 8 8 8
Number of functions 1 1 1 1
Number of terminals 32 32 32 32
word count 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
organize 256KX8 256KX8 256KX8 256KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SOP SOP DIP
Encapsulate equivalent code DIP32,.6 SOP32,.56 SOP32,.56 DIP32,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE SMALL OUTLINE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
power supply 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 5.08 mm 3.05 mm 3.05 mm 5.08 mm
Maximum standby current 0.00003 A 0.00003 A 0.00003 A 0.00003 A
Maximum slew rate 0.05 mA 0.05 mA 0.05 mA 0.05 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount NO YES YES NO
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE GULL WING GULL WING THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL
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