HN62302BF-17 datasheet, PDF - EEWORLD Datasheet

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HN62302BF-17: DescriptionMASK ROM, 256KX8, 170ns, CMOS, PDSO32, PLASTIC, SOP-32; Categorystorage storage; File Size90KB，4 Pages; ManufacturerHitachi （Renesas ）; Websitehttp://www.renesas.com/eng/

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HN62302BF-17 Overview

MASK ROM, 256KX8, 170ns, CMOS, PDSO32, PLASTIC, SOP-32

HN62302BF-17 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Hitachi （Renesas ）
Parts packaging code	SOIC
package instruction	SOP, SOP32,.56
Contacts	32
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	170 ns
JESD-30 code	R-PDSO-G32
JESD-609 code	e0
length	20.45 mm
memory density	2097152 bit
Memory IC Type	MASK ROM
memory width	8
Number of functions	1
Number of terminals	32
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX8
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP32,.56
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Maximum seat height	3.05 mm
Maximum standby current	0.00003 A
Maximum slew rate	0.05 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL

HN62302BF-17 Related Products

	HN62302BF-17	HN62302BF-20	HN62302BP-17	HN62302BP-20
Description	MASK ROM, 256KX8, 170ns, CMOS, PDSO32, PLASTIC, SOP-32	MASK ROM, 256KX8, 200ns, CMOS, PDSO32, PLASTIC, SOP-32	MASK ROM, 256KX8, 170ns, CMOS, PDIP32, PLASTIC, DIP-32	MASK ROM, 256KX8, 200ns, CMOS, PDIP32, PLASTIC, DIP-32
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）
Parts packaging code	SOIC	SOIC	DIP	DIP
package instruction	SOP, SOP32,.56	SOP, SOP32,.56	DIP, DIP32,.6	DIP, DIP32,.6
Contacts	32	32	32	32
Reach Compliance Code	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99
Maximum access time	170 ns	200 ns	170 ns	200 ns
JESD-30 code	R-PDSO-G32	R-PDSO-G32	R-PDIP-T32	R-PDIP-T32
JESD-609 code	e0	e0	e0	e0
length	20.45 mm	20.45 mm	41.9 mm	41.9 mm
memory density	2097152 bit	2097152 bit	2097152 bit	2097152 bit
Memory IC Type	MASK ROM	MASK ROM	MASK ROM	MASK ROM
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of terminals	32	32	32	32
word count	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
organize	256KX8	256KX8	256KX8	256KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	SOP	DIP	DIP
Encapsulate equivalent code	SOP32,.56	SOP32,.56	DIP32,.6	DIP32,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.05 mm	3.05 mm	5.08 mm	5.08 mm
Maximum standby current	0.00003 A	0.00003 A	0.00003 A	0.00003 A
Maximum slew rate	0.05 mA	0.05 mA	0.05 mA	0.05 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	YES	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL

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