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HSMP-389L-TR1

Description
100V, SILICON, PIN DIODE, SOT-363, 6 PIN
CategoryDiscrete semiconductor    diode   
File Size259KB,12 Pages
ManufacturerAVAGO
Websitehttp://www.avagotech.com/
Download Datasheet Parametric View All

HSMP-389L-TR1 Overview

100V, SILICON, PIN DIODE, SOT-363, 6 PIN

HSMP-389L-TR1 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerAVAGO
Parts packaging codeSOT-363
package instructionR-PDSO-G6
Contacts6
Reach Compliance Codecompliant
ECCN codeEAR99
applicationSWITCHING
Minimum breakdown voltage100 V
ConfigurationSEPARATE, 3 ELEMENTS
Maximum diode capacitance0.3 pF
Nominal diode capacitance0.3 pF
Diode component materialsSILICON
Maximum diode forward resistance2.5 Ω
Diode resistance test current5 mA
Diode resistance test frequency100 MHz
Diode typePIN DIODE
JESD-30 codeR-PDSO-G6
JESD-609 codee0
Minority carrier nominal lifetime0.2 µs
Number of components3
Number of terminals6
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Reverse test voltage5 V
surface mountYES
technologyPOSITIVE-INTRINSIC-NEGATIVE
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
HSMP-389x Series, HSMP-489x Series
Surface Mount RF PIN Switch Diodes
Data Sheet
Description/Applications
The HSMP-389x series is optimized for switching appli-
cations where low resistance at low current and low ca-
pacitance are required. The HSMP-489x series products
feature ultra low parasitic inductance. These products
are specifically designed for use at frequencies which
are much higher than the upper limit for conventional
PIN diodes.
Features
• Unique Configurations in Surface Mount Packages
– Add Flexibility
– Save Board Space
– Reduce Cost
• Switching
– Low Capacitance
– Low Resistance at Low Current
• Low Failure in Time (FIT) Rate
[1]
Pin Connections and Package Marking
1
6
• Matched Diodes for Consistent Performance
• Better Thermal Conductivity for Higher Power
Dissipation
• Lead-free Option Available
Note:
1. For more information see the Surface Mount PIN Reliability Data
Sheet.
GUx
2
3
5
4
Notes:
1. Package marking provides orientation, identification, and date
code.
2. See “Electrical Specifications” for appropriate package marking.
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