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IS62LV12816LL-10TI

Description
Standard SRAM, 128KX16, 100ns, CMOS, PDSO44, TSOP2-44
Categorystorage    storage   
File Size110KB,10 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
Download Datasheet Parametric Compare View All

IS62LV12816LL-10TI Overview

Standard SRAM, 128KX16, 100ns, CMOS, PDSO44, TSOP2-44

IS62LV12816LL-10TI Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIntegrated Silicon Solution ( ISSI )
Parts packaging codeTSOP2
package instructionTSOP2-44
Contacts44
Reach Compliance Codecompliant
ECCN code3A991.B.2.A
Maximum access time100 ns
Other featuresCONFIGURABLE AS 128K X 16
I/O typeCOMMON
JESD-30 codeR-PDSO-G44
JESD-609 codee0
length18.41 mm
memory density2097152 bit
Memory IC TypeSTANDARD SRAM
memory width16
Number of functions1
Number of terminals44
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128KX16
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP2
Encapsulate equivalent codeTSOP44,.46,32
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Minimum standby current1.5 V
Maximum slew rate0.04 mA
Maximum supply voltage (Vsup)3.45 V
Minimum supply voltage (Vsup)2.5 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width10.16 mm

IS62LV12816LL-10TI Related Products

IS62LV12816LL-10TI IS62LV12816LL-10BI
Description Standard SRAM, 128KX16, 100ns, CMOS, PDSO44, TSOP2-44 Standard SRAM, 128KX16, 100ns, CMOS, PBGA48, 6 X 8 MM, MINI, BGA-48
Is it Rohs certified? incompatible incompatible
Maker Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )
Parts packaging code TSOP2 BGA
package instruction TSOP2-44 6 X 8 MM, MINI, BGA-48
Contacts 44 48
Reach Compliance Code compliant compliant
ECCN code 3A991.B.2.A 3A991.B.2.A
Maximum access time 100 ns 100 ns
Other features CONFIGURABLE AS 128K X 16 CONFIGURABLE AS 128K X 16
I/O type COMMON COMMON
JESD-30 code R-PDSO-G44 R-PBGA-B48
JESD-609 code e0 e0
length 18.41 mm 8 mm
memory density 2097152 bit 2097152 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
memory width 16 16
Number of functions 1 1
Number of terminals 44 48
word count 131072 words 131072 words
character code 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
organize 128KX16 128KX16
Output characteristics 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP2 LFBGA
Encapsulate equivalent code TSOP44,.46,32 BGA48,6X8,30
Package shape RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
power supply 3 V 3 V
Certification status Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.35 mm
Minimum standby current 1.5 V 1.5 V
Maximum slew rate 0.04 mA 0.04 mA
Maximum supply voltage (Vsup) 3.45 V 3.45 V
Minimum supply voltage (Vsup) 2.5 V 2.5 V
Nominal supply voltage (Vsup) 3 V 3 V
surface mount YES YES
technology CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING BALL
Terminal pitch 0.8 mm 0.75 mm
Terminal location DUAL BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
width 10.16 mm 6 mm

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