IS62LV12816LL-10BI datasheet, PDF

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IS62LV12816LL-10BI: DescriptionStandard SRAM, 128KX16, 100ns, CMOS, PBGA48, 6 X 8 MM, MINI, BGA-48; Categorystorage storage; File Size110KB，10 Pages; ManufacturerIntegrated Silicon Solution ( ISSI )

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IS62LV12816LL-10BI Overview

Standard SRAM, 128KX16, 100ns, CMOS, PBGA48, 6 X 8 MM, MINI, BGA-48

IS62LV12816LL-10BI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Integrated Silicon Solution ( ISSI )
Parts packaging code	BGA
package instruction	6 X 8 MM, MINI, BGA-48
Contacts	48
Reach Compliance Code	compliant
ECCN code	3A991.B.2.A
Maximum access time	100 ns
Other features	CONFIGURABLE AS 128K X 16
I/O type	COMMON
JESD-30 code	R-PBGA-B48
JESD-609 code	e0
length	8 mm
memory density	2097152 bit
Memory IC Type	STANDARD SRAM
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of terminals	48
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	128KX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Encapsulate equivalent code	BGA48,6X8,30
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3 V
Certification status	Not Qualified
Maximum seat height	1.35 mm
Minimum standby current	1.5 V
Maximum slew rate	0.04 mA
Maximum supply voltage (Vsup)	3.45 V
Minimum supply voltage (Vsup)	2.5 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	6 mm

IS62LV12816LL-10BI Related Products

	IS62LV12816LL-10BI	IS62LV12816LL-10TI
Description	Standard SRAM, 128KX16, 100ns, CMOS, PBGA48, 6 X 8 MM, MINI, BGA-48	Standard SRAM, 128KX16, 100ns, CMOS, PDSO44, TSOP2-44
Is it Rohs certified?	incompatible	incompatible
Maker	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )
Parts packaging code	BGA	TSOP2
package instruction	6 X 8 MM, MINI, BGA-48	TSOP2-44
Contacts	48	44
Reach Compliance Code	compliant	compliant
ECCN code	3A991.B.2.A	3A991.B.2.A
Maximum access time	100 ns	100 ns
Other features	CONFIGURABLE AS 128K X 16	CONFIGURABLE AS 128K X 16
I/O type	COMMON	COMMON
JESD-30 code	R-PBGA-B48	R-PDSO-G44
JESD-609 code	e0	e0
length	8 mm	18.41 mm
memory density	2097152 bit	2097152 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM
memory width	16	16
Number of functions	1	1
Number of terminals	48	44
word count	131072 words	131072 words
character code	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
organize	128KX16	128KX16
Output characteristics	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	TSOP2
Encapsulate equivalent code	BGA48,6X8,30	TSOP44,.46,32
Package shape	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED
power supply	3 V	3 V
Certification status	Not Qualified	Not Qualified
Maximum seat height	1.35 mm	1.2 mm
Minimum standby current	1.5 V	1.5 V
Maximum slew rate	0.04 mA	0.04 mA
Maximum supply voltage (Vsup)	3.45 V	3.45 V
Minimum supply voltage (Vsup)	2.5 V	2.5 V
Nominal supply voltage (Vsup)	3 V	3 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	BALL	GULL WING
Terminal pitch	0.75 mm	0.8 mm
Terminal location	BOTTOM	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
width	6 mm	10.16 mm

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