INCH-POUND
MIL-M-38510/135D
01 June 2005
SUPERSEDING
MIL-M-38510/135C
05 November 2003
MILITARY SPECIFICATION
MICROCIRCUITS, LINEAR, LOW OFFSET OPERATIONAL AMPLIFIERS, MONOLITHIC SILICON
This specification is approved for use by all Departments and Agencies of the Department of Defense.
Reactivated for new design as of 05 November 2003. May be used for either new or existing design acquisition.
The requirement for acquiring the product herein shall consist of this specification sheet and MIL-PRF-38535.
1. SCOPE
1.1 Scope. This specification covers the detail requirements for monolithic silicon, low offset operational
amplifiers. Two product assurance classes and a choice of case outlines and lead finishes are provided and are
reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been superseded by
MIL-PRF-38535, (see 6.4)
1.2 Part or identifying Number (PIN). The PIN is in accordance with MIL-PRF-38535, and as specified herein.
1.2.1 Device types. Devices may be monolithic or they may consist of two separate independent die. The device
types are as follows:
Device type
01
02
03
04
05
Circuit
Single operational amplifier, ultra low offset, internally compensated
Single operational amplifier, low offset, internally compensated
Single operational amplifier, ultra low offset, internally compensated,
ultra low noise
Dual operational amplifier, low offset, ultra low noise internally
compensated
Single operational amplifier, ultra low offset, internally compensated,
ultra low noise, broadband
1.2.2 Device class. The device class is the product assurance level as defined in MIL-PRF-38535.
1.2.3 Case outline. The case outline are as designated in MIL-STD-1835 and as follows:
Outline letter
C
G
P
2
Descriptive designator
GDIP1-T14 or CDIP2-T14
MACY1-X8
GDIP1-T8 or CDIP2-T8
CQCC1-N20
Terminals
14
8
8
20
Package style
Dual-in-line
Can
Dual-in-line
Square leadless chip carrier
Comments, suggestions, or questions on this document should be addressed to: Commander, Defense
Supply Center Columbus, ATTN: DSCC-VAS, 3990 East Broad St., Columbus, OH 43216-5000, or emailed
to
linear@dscc.dla.mil
. Since contact information can change, you may want to verify the currency of this
address information using the ASSIST Online database at
http://assist.daps.dla.mil
.
AMSC N/A
FSC 5962
MIL-M-38510/135D
1.3 Absolute maximum ratings.
Supply voltage (V
CC
) .......................................................................
±22
V
Input voltage (VIN) ...........................................................................
Differential input voltage range:
Device types 01 and 02 ................................................................
Device types 03, 04, and 05 .........................................................
Output short-circuit duration .............................................................
Lead temperature (soldering, 60 seconds) ......................................
Storage temperature range ..............................................................
Junction temperature (T
J
) ................................................................
Maximum power dissipation (P
D
) .....................................................
1.4 Recommended operating conditions.
Supply voltage range (V
CC
):
Device types 01 and 02 ................................................................
±4.5
V dc to
±20.0
V
Device types 03, 04, and 05 .........................................................
±4.5
V dc to
±18.0
V
Ambient operating temperature range (T
A
) ...................................... -55°C to +125°C
1.5
Power and thermal characteristics.
Case outlines
C
G
P
2
Maximum allowable power
dissipation
400 mW at T
A
= +125°C
330 mW at T
A
= +125°C
400 mW at T
A
= +125°C
400 mW at T
A
= +125°C
Maximum
Maximum
±V
CC
±30
V
±0.7
V
1/
+300°C
-65°C to +150°C
+175°C 2/
500 mW 3/
θ
JC
50°C/W
60°C/W
50°C/W
55°C/W
θ
JA
120°C/W
150°C/W
120°C/W
120°C/W
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This
section does not include documents cited in other sections of this specification or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this
specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications and standards form a part of this
specification to the extent specified herein. Unless otherwise specified, the issues of these documents are those
cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38535
- Integrated Circuits (Microcircuits) Manufacturing, General Specification for.
______
1/ Output may be shorted to ground indefinitely at V
S
=
±15
volts, T
A
= 25°C. Temperature and/or supply
voltages must be limited to ensure dissipation rating is not exceeded.
2/ For short term test (in the specific burn-in and steady state life test configuration when required and up to
168 hours maximum), T
J
= 175°C.
3/ Maximum power dissipation versus ambient temperature.
2
MIL-M-38510/135D
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
MIL-STD-1835
- Test Method Standard for Microelectronics.
- Interface Standard Electronic Component Case Outlines.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,
Philadelphia, PA 19111-5094.)
2.3 Order of precedence. In the event of a conflict between the text of this specification and the references cited
herein the text of this document shall take precedence. Nothing in this document, however, supersedes applicable
laws and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before
contract award (see 4.3 and 6.3).
3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as
specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the
QM plan shall not affect the form, fit, or function as described herein.
3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as
specified in MIL-PRF-38535 and herein.
3.3.1 Circuit diagram and terminal connections. The circuit diagram and terminal connections shall be as specified
on figure 1.
3.3.2 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available to
the qualifying activity and the preparing activity upon request.
3.3.3 Case outlines. The case outlines shall be as specified in 1.2.3.
3.4 Lead material and finish. The lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).
3.5 Electrical performance characteristics. The electrical performance characteristics are as specified in table I,
and unless otherwise specified, apply over the full recommended ambient operating temperature range for supply
voltages from
±4.5
V dc to
±20
V dc for device types 01 and 02 and for supply voltages from
±4.5
V dc to
±18
V dc for
device types 03, 04, and 05. Unless otherwise specified, source resistance (R
S
) shall be 50 ohms for all tests.
3.5.1 Offset null circuits. The nulling inputs shall be capable of being nulled 0.5 mV beyond the specified offset
voltage limits for –55°C
≤
T
A
≤
125°C using the circuit of figure 2.
3.5.2 Instability oscillations. The devices shall be free of oscillations when operated in the test circuits
of this specification.
3.6 Electrical test requirements. Electrical test requirements for each device class shall be the subgroups
specified in table II. The electrical tests for each subgroup are described in table III.
3.7 Marking. Marking shall be in accordance with MIL-PRF-38535.
3.8 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group
number 49 (see MIL-PRF-38535, appendix A).
3
MIL-M-38510/135D
TABLE I. Electrical performance characteristics.
Conditions 1/
±V
CC
=
±15
V,
unnulled,
see figure 3 and 3.5
unless otherwise specified
2/ 3/ 4/
see figure 4, T
A
= 25°C
Test
Symbol
Device
type
Min
01,03,
05
02
04
-25
-75
-80
-60
Limits
Max
25
75
80
60
200
180
100
175
180
0.6
1.3
1.0
2
3
40
4
6
60
3
4.5
50
Unit
Input offset voltage
V
IO
µV
2/ 3/
-55°C
≤
T
A
≤
+125°C
01,03,
05
02
04
-200
-180
-100
-175
-180
-0.6
-1.3
-1.0
-2
-3
-40
-4
-6
-60
-3
-4.5
-50
End point limit 4/
01,03,
05
02
04
Input offset voltage
temperature sensitivity
∆V
IO
/∆T
01,03,
05
02
04
µV/°C
Input bias current
+I
IB
T
A
= 25°C 2/
01
02
03,04,
05
nA
-55°C
≤
T
A
≤
+125°C 2/
01
02
03,04,
05
End point limit 4/
01
02
03,04,
05
See footnotes at end of table.
4
MIL-M-38510/135D
TABLE I. Electrical performance characteristics – Continued.
Conditions 1/
±V
CC
=
±15
V,
unnulled,
see figure 3 and 3.5
unless otherwise specified
Input bias current
-I
IB
T
A
= 25°C 2/
01
02
03,04,
05
-55°C
≤
T
A
≤
+125°C 2/
01
02
03,04,
05
01
02
03,04,
05
Input offset current
I
IO
T
A
= 25°C 2/
01
02
03,04,
05
-55°C
≤
T
A
≤
+125°C 2/
01
02
03,04,
05
01,02
Test
Symbol
Device
type
Min
-2
-3
-40
-4
-6
-60
-3
-4.5
-50
-2
-2.8
-35
-4
-5.6
-50
-10
Limits
Max
2
3
40
4
6
60
3
4.5
50
2
2.8
35
4
5.6
50
10
Unit
nA
End point limit 4/
nA
Power supply rejection
ratio
+PSRR
+V
CC
= 20 V to 5 V,
-V
CC
= -15 V, T
A
= 25°C
+V
CC
= 18 V to 5 V,
-V
CC
= -15 V, T
A
= 25°C
µV/V
03,04,
05
01,02
-10
10
-PSRR
-V
CC
= -20 V to -5 V,
+V
CC
= 15 V, T
A
= 25°C
-V
CC
= -18 V to -5 V,
+V
CC
= 15 V, T
A
= 25°C
-10
10
03,04,
05
-10
10
See footnotes at end of table.
5
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