2MX8 NON-VOLATILE SRAM MODULE, 100ns, DMA36, 0.740 INCH, DIP-36
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Rochester Electronics |
| Parts packaging code | MODULE |
| package instruction | 0.740 INCH, DIP-36 |
| Contacts | 36 |
| Reach Compliance Code | unknown |
| Maximum access time | 100 ns |
| JESD-30 code | R-XDMA-P36 |
| JESD-609 code | e0 |
| memory density | 16777216 bit |
| Memory IC Type | NON-VOLATILE SRAM MODULE |
| memory width | 8 |
| Humidity sensitivity level | NOT SPECIFIED |
| Number of functions | 1 |
| Number of terminals | 36 |
| word count | 2097152 words |
| character code | 2000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 2MX8 |
| Package body material | UNSPECIFIED |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | COMMERCIAL |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | TIN LEAD |
| Terminal form | PIN/PEG |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| DS1270W-100IND | DS1270W-100 | DS1270W-150# | DS1270W-150 | |
|---|---|---|---|---|
| Description | 2MX8 NON-VOLATILE SRAM MODULE, 100ns, DMA36, 0.740 INCH, DIP-36 | 2MX8 NON-VOLATILE SRAM MODULE, 100ns, DMA36, 0.740 INCH, DIP-36 | 2MX8 NON-VOLATILE SRAM MODULE, 150ns, DMA36, 0.740 INCH, ROHS COMPLIANT, DIP-36 | 2MX8 NON-VOLATILE SRAM MODULE, 150ns, DMA36, 0.740 INCH, DIP-36 |
| Is it lead-free? | Contains lead | Contains lead | Lead free | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | conform to | incompatible |
| Maker | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| Parts packaging code | MODULE | MODULE | MODULE | MODULE |
| package instruction | 0.740 INCH, DIP-36 | 0.740 INCH, DIP-36 | 0.740 INCH, ROHS COMPLIANT, DIP-36 | 0.740 INCH, DIP-36 |
| Contacts | 36 | 36 | 36 | 36 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| Maximum access time | 100 ns | 100 ns | 150 ns | 150 ns |
| JESD-30 code | R-XDMA-P36 | R-XDMA-P36 | R-XDMA-P36 | R-XDMA-P36 |
| JESD-609 code | e0 | e0 | e3 | e0 |
| memory density | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
| Memory IC Type | NON-VOLATILE SRAM MODULE | NON-VOLATILE SRAM MODULE | NON-VOLATILE SRAM MODULE | NON-VOLATILE SRAM MODULE |
| memory width | 8 | 8 | 8 | 8 |
| Humidity sensitivity level | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 36 | 36 | 36 | 36 |
| word count | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
| character code | 2000000 | 2000000 | 2000000 | 2000000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C | 70 °C | 70 °C | 70 °C |
| organize | 2MX8 | 2MX8 | 2MX8 | 2MX8 |
| Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | 240 | NOT SPECIFIED | 240 |
| Certification status | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | TIN LEAD | TIN LEAD | MATTE TIN | TIN LEAD |
| Terminal form | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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