DS1270W-100 datasheet, PDF - EEWORLD Datasheet

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DS1270W-100: Description2MX8 NON-VOLATILE SRAM MODULE, 100ns, DMA36, 0.740 INCH, DIP-36; Categorystorage storage; File Size872KB，9 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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DS1270W-100 Overview

2MX8 NON-VOLATILE SRAM MODULE, 100ns, DMA36, 0.740 INCH, DIP-36

DS1270W-100 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Rochester Electronics
Parts packaging code	MODULE
package instruction	0.740 INCH, DIP-36
Contacts	36
Reach Compliance Code	unknown
Maximum access time	100 ns
JESD-30 code	R-XDMA-P36
JESD-609 code	e0
memory density	16777216 bit
Memory IC Type	NON-VOLATILE SRAM MODULE
memory width	8
Humidity sensitivity level	NOT SPECIFIED
Number of functions	1
Number of terminals	36
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2MX8
Package body material	UNSPECIFIED
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	240
Certification status	COMMERCIAL
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	PIN/PEG
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

DS1270W-100 Related Products

	DS1270W-100	DS1270W-100IND	DS1270W-150#	DS1270W-150
Description	2MX8 NON-VOLATILE SRAM MODULE, 100ns, DMA36, 0.740 INCH, DIP-36	2MX8 NON-VOLATILE SRAM MODULE, 100ns, DMA36, 0.740 INCH, DIP-36	2MX8 NON-VOLATILE SRAM MODULE, 150ns, DMA36, 0.740 INCH, ROHS COMPLIANT, DIP-36	2MX8 NON-VOLATILE SRAM MODULE, 150ns, DMA36, 0.740 INCH, DIP-36
Is it lead-free?	Contains lead	Contains lead	Lead free	Contains lead
Is it Rohs certified?	incompatible	incompatible	conform to	incompatible
Maker	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics
Parts packaging code	MODULE	MODULE	MODULE	MODULE
package instruction	0.740 INCH, DIP-36	0.740 INCH, DIP-36	0.740 INCH, ROHS COMPLIANT, DIP-36	0.740 INCH, DIP-36
Contacts	36	36	36	36
Reach Compliance Code	unknown	unknown	unknown	unknown
Maximum access time	100 ns	100 ns	150 ns	150 ns
JESD-30 code	R-XDMA-P36	R-XDMA-P36	R-XDMA-P36	R-XDMA-P36
JESD-609 code	e0	e0	e3	e0
memory density	16777216 bit	16777216 bit	16777216 bit	16777216 bit
Memory IC Type	NON-VOLATILE SRAM MODULE	NON-VOLATILE SRAM MODULE	NON-VOLATILE SRAM MODULE	NON-VOLATILE SRAM MODULE
memory width	8	8	8	8
Humidity sensitivity level	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Number of functions	1	1	1	1
Number of terminals	36	36	36	36
word count	2097152 words	2097152 words	2097152 words	2097152 words
character code	2000000	2000000	2000000	2000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	85 °C	70 °C	70 °C
organize	2MX8	2MX8	2MX8	2MX8
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	240	NOT SPECIFIED	NOT SPECIFIED	240
Certification status	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL
Terminal surface	TIN LEAD	TIN LEAD	MATTE TIN	TIN LEAD
Terminal form	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

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