Flash, 32MX16, 76ns, PBGA63, 9.50 X 12 MM, 1 MM HEIGHT, 0.80 MM PITCH, FBGA-63
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | SAMSUNG |
Parts packaging code | BGA |
package instruction | VFBGA, |
Contacts | 63 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.1.A |
Maximum access time | 76 ns |
Other features | SYNCHRONOUS BURST OPERATION IS POSSIBLE |
JESD-30 code | R-PBGA-B63 |
JESD-609 code | e1 |
length | 12 mm |
memory density | 536870912 bit |
Memory IC Type | FLASH |
memory width | 16 |
Humidity sensitivity level | 2 |
Number of functions | 1 |
Number of terminals | 63 |
word count | 33554432 words |
character code | 32000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -30 °C |
organize | 32MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | VFBGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
Programming voltage | 1.8 V |
Certification status | Not Qualified |
Maximum seat height | 1 mm |
Maximum supply voltage (Vsup) | 1.95 V |
Minimum supply voltage (Vsup) | 1.7 V |
Nominal supply voltage (Vsup) | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | OTHER |
Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 40 |
width | 9.5 mm |