Flash, 2MX16, PBGA88, 8 X 10MM, 1.20 MM HEIGHT, ROHS COMPLIANT, BGA-88
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Intel |
Parts packaging code | BGA |
package instruction | TFBGA, |
Contacts | 88 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.1.A |
startup block | BOTTOM |
Maximum clock frequency (fCLK) | 54 MHz |
JESD-30 code | R-PBGA-B88 |
JESD-609 code | e1 |
length | 10 mm |
memory density | 33554432 bit |
Memory IC Type | FLASH |
memory width | 16 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 88 |
word count | 2097152 words |
character code | 2000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 2MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TFBGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
Parallel/Serial | SERIAL |
Peak Reflow Temperature (Celsius) | 260 |
Programming voltage | 1.8 V |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
Maximum supply voltage (Vsup) | 1.95 V |
Minimum supply voltage (Vsup) | 1.7 V |
Nominal supply voltage (Vsup) | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | TIN SILVER COPPER |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 40 |
type | NOR TYPE |
width | 8 mm |