IC,DATA ENCRYPTION PROCESSOR,MOS,DIP,24PIN,CERAMIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | NXP |
package instruction | DIP, DIP24,.6 |
Reach Compliance Code | unknown |
JESD-30 code | R-XDIP-T24 |
JESD-609 code | e0 |
Number of functions | 1 |
Number of terminals | 24 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP24,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Certification status | Not Qualified |
surface mount | NO |
technology | MOS |
Telecom integrated circuit types | DATA ENCRYPTION CIRCUIT |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |