Standard SRAM, 64KX24, 15ns, CMOS, PBGA48, 6 X 8 MM, 0.75 MM PITCH, FBGA-48
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | GSI Technology |
Parts packaging code | BGA |
package instruction | TFBGA, BGA48,6X8,30 |
Contacts | 48 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.2.B |
Maximum access time | 15 ns |
I/O type | COMMON |
JESD-30 code | R-PBGA-B48 |
JESD-609 code | e0 |
length | 8 mm |
memory density | 1572864 bit |
Memory IC Type | STANDARD SRAM |
memory width | 24 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 48 |
word count | 65536 words |
character code | 64000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 64KX24 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | TFBGA |
Encapsulate equivalent code | BGA48,6X8,30 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
Maximum standby current | 0.015 A |
Minimum standby current | 3 V |
Maximum slew rate | 0.115 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | BALL |
Terminal pitch | 0.75 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 6 mm |