AS7E32K32P120XT datasheet, PDF

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AS7E32K32P120XT: DescriptionEEPROM Module, 32KX32, 120ns, Parallel, CMOS, CPGA66, 1.090 INCH, PGA-66; Categorystorage storage; File Size132KB，13 Pages; ManufacturerMicross; Websitehttps://www.micross.com

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AS7E32K32P120XT Overview

EEPROM Module, 32KX32, 120ns, Parallel, CMOS, CPGA66, 1.090 INCH, PGA-66

AS7E32K32P120XT Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Micross
Parts packaging code	PGA
package instruction	PGA, PGA66,11X11
Contacts	66
Reach Compliance Code	compliant
ECCN code	3A001.A.2.C
Maximum access time	120 ns
Other features	USER CONFIGURABLE AS 128K X 8
Spare memory width	16
Data polling	YES
Durability	10000 Write/Erase Cycles
JESD-30 code	S-CPGA-P66
JESD-609 code	e0
length	27.686 mm
memory density	1048576 bit
Memory IC Type	EEPROM MODULE
memory width	32
Number of functions	1
Number of terminals	66
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	32KX32
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA
Encapsulate equivalent code	PGA66,11X11
Package shape	SQUARE
Package form	GRID ARRAY
page size	64 words
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Programming voltage	5 V
Certification status	Not Qualified
Maximum seat height	8.382 mm
Maximum standby current	0.1 A
Maximum slew rate	0.34 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
Maximum time at peak reflow temperature	NOT SPECIFIED
switch bit	YES
width	27.686 mm
Maximum write cycle time (tWC)	10 ms
write protect	SOFTWARE

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Description	EEPROM Module, 32KX32, 120ns, Parallel, CMOS, CPGA66, 1.090 INCH, PGA-66	EEPROM Module, 32KX32, 90ns, Parallel, CMOS, CPGA66, 1.090 INCH, PGA-66	EEPROM Module, 32KX32, 70ns, Parallel, CMOS, CPGA66, 1.090 INCH, PGA-66	EEPROM Module, 32KX32, 120ns, Parallel, CMOS, CPGA66, 1.090 INCH, PGA-66	32KX32 EEPROM 5V MODULE, 90ns, CPGA66, 1.090 INCH, PGA-66	EEPROM Module, 32KX32, 90ns, Parallel, CMOS, CPGA66, 1.090 INCH, PGA-66
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	PGA	PGA	PGA	PGA	PGA	PGA
package instruction	PGA, PGA66,11X11	PGA,	PGA,	PGA,	PGA, PGA66,11X11	PGA, PGA66,11X11
Contacts	66	66	66	66	66	66
Reach Compliance Code	compliant	unknown	unknown	unknown	unknown	compliant
Maximum access time	120 ns	90 ns	70 ns	120 ns	90 ns	90 ns
Other features	USER CONFIGURABLE AS 128K X 8	USER CONFIGURABLE AS 128K X 8	USER CONFIGURABLE AS 128K X 8	USER CONFIGURABLE AS 128K X 8	USER CONFIGURABLE AS 128K X 8	USER CONFIGURABLE AS 128K X 8
Spare memory width	16	16	16	16	16	16
JESD-30 code	S-CPGA-P66	S-CPGA-P66	S-CPGA-P66	S-CPGA-P66	S-CPGA-P66	S-CPGA-P66
JESD-609 code	e0	e0	e0	e0	e0	e0
length	27.686 mm	27.686 mm	27.686 mm	27.686 mm	27.686 mm	27.686 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	EEPROM MODULE	EEPROM MODULE	EEPROM MODULE	EEPROM MODULE	EEPROM MODULE	EEPROM MODULE
memory width	32	32	32	32	32	32
Number of functions	1	1	1	1	1	1
Number of terminals	66	66	66	66	66	66
word count	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words
character code	32000	32000	32000	32000	32000	32000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	85 °C	85 °C	85 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-40 °C	-40 °C	-40 °C	-55 °C	-55 °C
organize	32KX32	32KX32	32KX32	32KX32	32KX32	32KX32
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA	PGA	PGA	PGA	PGA	PGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Programming voltage	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	8.382 mm	8.382 mm	8.382 mm	8.382 mm	8.382 mm	8.382 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	MILITARY	MILITARY
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
Terminal form	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	27.686 mm	27.686 mm	27.686 mm	27.686 mm	27.686 mm	27.686 mm
Maximum write cycle time (tWC)	10 ms	10 ms	10 ms	10 ms	10 ms	10 ms
Maker	Micross	-	Micross	Micross	Micross	Micross
ECCN code	3A001.A.2.C	EAR99	3A991.B.1.B.2	EAR99	-	3A001.A.2.C

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