|
FSGJ264D1 |
FSGJ264R4 |
FSGJ264R3 |
Description |
Power Field-Effect Transistor, 42A I(D), 250V, 0.049ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-254AA |
Power Field-Effect Transistor, 42A I(D), 250V, 0.049ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-254AA |
Power Field-Effect Transistor, 42A I(D), 250V, 0.049ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-254AA |
Is it lead-free? |
Contains lead |
Contains lead |
Contains lead |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
Maker |
International Rectifier ( Infineon ) |
International Rectifier ( Infineon ) |
International Rectifier ( Infineon ) |
package instruction |
FLANGE MOUNT, S-MSFM-P3 |
FLANGE MOUNT, S-MSFM-P3 |
FLANGE MOUNT, S-MSFM-P3 |
Reach Compliance Code |
compliant |
compliant |
compliant |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
Shell connection |
ISOLATED |
ISOLATED |
ISOLATED |
Configuration |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
Minimum drain-source breakdown voltage |
250 V |
250 V |
250 V |
Maximum drain current (ID) |
42 A |
42 A |
42 A |
Maximum drain-source on-resistance |
0.049 Ω |
0.049 Ω |
0.049 Ω |
FET technology |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
JEDEC-95 code |
TO-254AA |
TO-254AA |
TO-254AA |
JESD-30 code |
S-MSFM-P3 |
S-MSFM-P3 |
S-MSFM-P3 |
JESD-609 code |
e0 |
e0 |
e0 |
Number of components |
1 |
1 |
1 |
Number of terminals |
3 |
3 |
3 |
Operating mode |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
Maximum operating temperature |
150 °C |
150 °C |
150 °C |
Package body material |
METAL |
METAL |
METAL |
Package shape |
SQUARE |
SQUARE |
SQUARE |
Package form |
FLANGE MOUNT |
FLANGE MOUNT |
FLANGE MOUNT |
Peak Reflow Temperature (Celsius) |
235 |
NOT SPECIFIED |
NOT SPECIFIED |
Polarity/channel type |
N-CHANNEL |
N-CHANNEL |
N-CHANNEL |
Maximum pulsed drain current (IDM) |
160 A |
160 A |
160 A |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
surface mount |
NO |
NO |
NO |
Terminal surface |
TIN LEAD |
TIN LEAD |
TIN LEAD |
Terminal form |
PIN/PEG |
PIN/PEG |
PIN/PEG |
Terminal location |
SINGLE |
SINGLE |
SINGLE |
Maximum time at peak reflow temperature |
30 |
NOT SPECIFIED |
NOT SPECIFIED |
transistor applications |
SWITCHING |
SWITCHING |
SWITCHING |
Transistor component materials |
SILICON |
SILICON |
SILICON |